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In this paper, a compact computer-aided design (CAD)-oriented frequency-independent equivalent-circuit model, taking the skin effect, proximity effect, and substrate effect into consideration, is presented for the edge-suspended coplanar waveguide (ESCPW) on lossy silicon substrate. The ESCPWs exhibit the benefit of reduced loss, while avoid the reliability issues that are associated with the suspended coplanar waveguides. The model shows good agreement with the measured insertion loss and the extracted RLGC line parameters up to 25 GHz. With the model, the relationship between physical perimeters of the ESCPWs and the electrical characteristics is also investigated. Moreover, cross-coupling between adjacent ESCPWs with common ground is characterized and modeled. [ABSTRACT FROM AUTHOR]

We report several types of coplanar waveguide tri-section stepped-impedance resonator (SIR) structures that offer further size reduction compared to the conventional two-section SIRs. In addition, the tri-section SIRs provide flexibility of introducing effective capacitive coupling to the ground lines for realizing slow-wave structures. The slow-wave effect can be used to implement more compact bandpass filters. The principles of achieving size reductions using tri-section SIRs are described and confirmed by simulation results. To demonstrate the effectiveness of the proposed tri-section SIRs in size reduction, the tri-section SIRs with slow-wave effects were implemented in a two-pole directly coupled bandpass filter and a fourth-order quasi-elliptic bandpass filter with reduced size. The measured results matched well with the theoretical prediction. [ABSTRACT FROM AUTHOR]

In this paper, we present the detailed fabrication process, high-frequency characterization, and modeling of through-wafer copper-filled vias ranging from 50- to 70-μm-in diameter on 400-μm-thick silicon substrates. The high aspect ratio via-holes were fabricated by carefully optimizing the inductively coupled plasma deep reactive ion etching process. The high aspect ratio via-holes are completely filled with copper using a bottom-up electroplating approach. The fabricated vias were characterized using different resonating structures based on which the inductance and resistance of the filled via-holes are extracted. For a single 70-μm via, the inductance and resistance are measured to be 254 pH and 0.1 Ω, respectively. In addition, the effect of the physical arrangement and distribution in multiple-via configurations on the resulting inductance is also evaluated with double straightly aligned quadruple and diagonally aligned quadruple vias. Physical mechanisms of the dependence was depicted by electromagnetic simulation. An equivalent-circuit model is proposed and model parameters are extracted to provide good agreement. [ABSTRACT FROM AUTHOR]

A low phase-noise X-band monolithic-microwave integrated-circuit voltage-controlled oscillator (VCO) based on a novel high-linearity and low-noise composite-channel A10.3 Ga0.7N/A10.05 Ga0.95 N/GaN high electron mobility transistor (HEMT) is presented. The HEMT has a 1 μm × 100 μm gate. A planar inter-digitated metal-semiconductor-metal varactor is used to tune the VCO's frequency. The polyimide dielectric layer is inserted between a metal and GaN buffer to improve the Q factor of spiral inductors. The VCO exhibits a frequency tuning range from 9.11 to 9.55 GHz with the varactor's voltage from 4 to 6 V, an average output power of 3.3 dBm, and an average efficiency of 7% at a gate bias of -3 V and a drain bias of 5 V. The measured phase noise is -82 dBc/Hz and -110 dBc/Hz at offsets of 100 kHz and 1 MHz at a varactor's voltage (Vtune) = 5 V. The phase noise is the lowest reported thus far in VCOs made of GaN-based HEMTs. In addition, the VCO also exhibits the minimum second harmonic suppression of 47 dBc. The chip size is 1.2 × 1.05 mm2. [ABSTRACT FROM AUTHOR]