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The 2019 International Conference on Modeling and Analysis of Semiconductor Manufacturing (MASM 2019) was part of the 2019 Winter Simulation Conference (WSC) that was held December 8–11 in National Harbor, MD, USA. The MASM conferences provide a forum for the exchange of ideas and industrial innovations between researchers and practitioners from around the world involved in modeling and analysis of complex high-tech manufacturing systems. While the papers from MASM conferences are of high quality and are often cited in journal papers, they are limited in size. As a premier journal for topics covered in the MASM conferences, IEEE Transactions on Semiconductor Manufacturing, agreed to consider extended article submissions based on the 21 papers accepted and presented at the MASM 2019 conference for a Special Section of an upcoming issue of the journal. were sessions on Scheduling and Dispatching, Fab Scheduling, Maintenance and Engineering, Capacity and Production Planning, Qualification and Wafer-to-Order Allocation, Semiconductor Manufacturing Models, and Semiconductor Modeling Representations. Dr. Sabine Herlitschka, Chief Executive Officer and Chief Technology Officer of Infineon Technologies Austria AG, gave an excellent keynote talk titled “A European View on Future Semiconductor Industry Needs for MASM.” An archive of the MASM 2019 papers can be found at https://informs-sim.org/wsc19papers/by_area.html. [ABSTRACT FROM AUTHOR]

Transistor random threshold voltage variations due to process fluctuations seriously affects the stability of Static Random Access Memory (SRAM). In this paper, a SRAM bit transistors threshold voltage $({Vth})$ deviation monitoring scheme and system is proposed. This scheme ingeniously achieves on-chip measurement of all transistors threshold voltages without altering compact SRAM bit array layout. Control signal strategies and Transistor ${Vth}$ Determination Circuit (TVDC) for different types of Devices Under Test (DUTs) have been proposed. The system is implemented using a 65 nm CMOS process with a core area of 0.01875mm2. Through Monte Carlo analysis, the Weighted Average (WA) difference of the proposed scheme and the direct measurement method is not more than 10mV, and the Root Mean Square Error (RMSE) difference is not more than 3mV. This system can also effectively detect the cell position of the transistor threshold voltage mismatch simulated by modifying the substrate voltage. For SRAM arrays of different scales, the method proposed in this paper has area efficiency and flexible reconfigurability. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

This paper studies simultaneous scheduling of production and material transfer that arises in the semiconductor photolithography area. In particular, the right reticle and right job both need to be present to process the job. Jobs are transferred by a material handling system that employees a fleet of vehicles. Reticles serving as an auxiliary resource are also transferred from one place to another by a different set of vehicles. This intricate scheduling challenge, encompassing jobs, reticles, machines, and two distinct sets of vehicles, is explored here for the first time. The paper introduces a multi-stage methodology that involves relaxation, a constructive heuristic, constraint programming, and a warm-start approach to address this complex problem. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

The document is the table of contents for the May 2024 issue of the IEEE Transactions on Semiconductor Manufacturing. It includes papers on various topics such as yield modeling, analysis, and enhancement, advanced processing, advanced process control, equipment and automation technology, non-silicon materials, emerging areas, and environment, safety, and health. The articles cover subjects such as chip-scale chemical mechanical polishing, threshold voltage deviation monitoring, curvilinear standard cell design, fabrication of silicon nanocone arrays, improving the reliability of through silicon vias, energy consumption and carbon emission reduction in HVAC systems, low-k silicon dioxide synthesis, chemical mechanical polishing of diamond epitaxial layers, conditional variable selection based on deep learning, and eco-friendly dry-cleaning and diagnostics of silicon dioxide deposition chambers. The document also includes an announcement for the call for nominations for the 2024 IEEE EDS Early Career Award. [Extracted from the article]

Chemical mechanical polishing/planarization (CMP) combines physical grinding and chemical reactions to planarize the wafer surface. The complex mechanism of CMP brings great challenges to the mechanism-based modeling process. The data-driven CMP modeling process is limited by insufficient datasets. At the same time, these two types of models generally have high computational complexity. In this paper, we introduce the group method of data handling (GMDH)-type polynomial network to build the CMP model to address the above challenges. We designed and manufactured the test chip using a 28nm process. The measurement data from the test chip shows that compared with the mechanism-based CMP model, the trained CMP model based on GMDH-type polynomial network has higher accuracy and lower computational complexity, with the average simulation speed being 115x faster. Experiments based on silicon data show that this modeling method has a small demand for data, and 20 randomly selected sets of data can meet the needs for modeling the current CMP process. [ABSTRACT FROM AUTHOR]

This is a panel paper that discusses the use of Artificial Intelligence (AI) technologies to address production and supply chain level problems in semiconductor manufacturing. We have gathered a group of expert semiconductor researchers and practitioners from around the world who have developed AI solutions for various semiconductor problems. This paper aims to provide their answers to an initial set of questions and provide an overview of the AI developments and empirical studies to make suggestions for future directions in this arena. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

This paper proposes a linear regression model for scalar-valued responses and two-way functional (bivariate) predictors. Our motivation stems from the quality evaluation of products based on optical emission spectroscopy data from virtual metrology of semiconductor manufacturing. We focus on multivariate cases where the smoothness and shapes of the data vary significantly across variables. We propose a two-step solution to this problem, consisting of decomposition and prediction. First, we decompose the two-way functional data into pairs of component functions using functional singular value decomposition. Next, we build functional linear models for the decomposed functional variables and obtain the final predictor by averaging the models. Results from numerical studies, including simulation studies and real data analysis, demonstrate the promising empirical properties of the proposed approach, especially when the number of predictors is large. [ABSTRACT FROM AUTHOR]

It has been a widely growing interest in using silicon carbide (SiC) in high-power electronic devices. Yet, SiC wafers may contain killer defects that could reduce fabrication yield and make the device fall into unexpected failures. To prevent these failures from happening, it is very important to develop inspection tools that can detect, characterize and locate these defects in a non-invasive way. Current inspection techniques such as Dark Field or Bright field microscopy are effectively able to visualize most such defects; however, there are some scenarios where the inspection becomes problematic or almost impossible, such as when the defects are too small or have low contrast or if the defects lie deep into the substrate. Thus, an alternative method is needed to face these challenges. In this paper, we demonstrate the application of coherent Fourier scatterometry (CFS) as a complementary tool in addition to the conventional techniques to overcome different and problematic scenarios of killer defects inspection on SiC samples. Scanning electron microscopy (SEM) has been used to assess the same defects to validate the findings of CFS. Great consistency has been demonstrated in the comparison between the results obtained with CFS and SEM. [ABSTRACT FROM AUTHOR]

This paper addresses the quality control of the photolithography process in the semiconductor industry. Overlay errors in the process seriously affect the wafer yield, and cause the wafer to be forced to rework and affect the production efficiency of the equipment. We examine the current state of its process control, develop a novel overlay predict model, and verify the prediction results. This study proposes a Global Attention Generative Adversarial Networks (GAGAN) model to precisely predict the overlay error for the feed-forward data of the front layer, which is used as the important information and process parameters for the advanced process control of the current layer. Experiment results on a semiconductor shop-floor confirms that our proposed method achieves high predictive performance while maintaining extensibility and visual quality. [ABSTRACT FROM AUTHOR]

A scheduling problem for parallel batch processing machines (BPMs) with jobs having unequal ready times in semiconductor wafer fabrication facilities (wafer fabs) is studied in this paper. A blended objective function combining the total weighted tardiness (TWT) and the total electricity cost (TEC) under a time-of-use (TOU) tariff is considered. A genetic programming (GP) procedure is designed to automatically discover priority indices for a heuristic scheduling framework. Results of computational experiments are reported that demonstrate that the learned priority indices lead to high-quality schedules in a short amount of computing time. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

For the 3D NAND memory, the higher oxide/nitride (ON) stacked dielectric is preferred to enhance the storage capacity, and multi-layer dielectric requirements, such as thickness uniformity and interfacial smoothness between films, gathers more interest for the performance of 3D NAND flash memory. Unsatisfactory thickness uniformity between layers is a challenge not only for the device performance but also the following etch process steps. The thickness uniformity can get worse with a little facility degradation. The degradation of the vacuum system, such as the throttle valve position, has the potential to cause process drift. This can have an impact on the thickness repeatability of each layer in a multiple dielectric stack. To reduce the process variation in multi-layer dielectric deposition for 3D NAND fabrication, process monitoring, and equipment diagnostic study is suggested in this paper. Optical emission spectroscopy (OES) is employed for plasma process monitoring and equipment state variable identification (SVID) data are investigated to find the source of the process variation. From the comparison experiments of 5 and 30 paired oxide/nitride stack deposition, we found equipment and/or facility degradation may induce the minute process drift. Among them, we suggest the potential of process drift due to the throttle valve position. [ABSTRACT FROM AUTHOR]

This paper studies the problem of scheduling machines in the photolithography area of a semiconductor manufacturing facility. The scheduling problem is characterized as an unrelated parallel machine scheduling problem with machine eligibilities, sequence- and machine-dependent setup times, auxiliary resources and transfer times for the auxiliary resources. Each job requires two auxiliary resources: a reticle and a pod. Reticles are handled in pods and a pod contains multiple reticles. Both reticles and pods are used on multiple machines and a transfer time is required if transferred from one machine to another. A novel constraint programming (CP) approach is proposed and is benchmarked against a mixed-integer programming (MIP) method. The results of the study, consisting of a real-world case study at a global semiconductor manufacturer, demonstrate that the CP approach significantly outperforms the MIP method and produces high-quality solutions for multiple real-world instances, although optimality cannot be guaranteed. [ABSTRACT FROM AUTHOR]

Wafer-level direct bonding technology is a key process for the production of backside illuminated (BSI) CMOS image sensor (CIS). Usually, constant-depth mode scanning acoustic microscope (C-SAM) 300mm wafer images are acquired and defect size distribution is provided to monitor defects that degrade bonding yield. This acquisition technique is used as it is nondestructive and is able to capture the full wafer. Current solutions are not providing information detailed enough to identify the root cause of this degradation. A consequence is that most measurements and classification is currently done manually which take time and have reproducibility issues. In this paper, we propose a rule-based method for the classification of the defects and automatic segmentation of the defects to extract precise measurements depending on the type of defect. The classes of defects are precisely defined based on their origin in the process. All these information will allow to reduce the time to analyze the images and improve the precision and consistency of the analysis. These results will allow to identify more precisely the defects thus the causes of yield degradation during bonding process. [ABSTRACT FROM AUTHOR]

This paper discusses the optimization of an advanced process monitoring scheme with interdicting fault detection and classification (FDC) capabilities that improved the control over the process development of Tantalum Nitride thin film resistors (TaN TFR). Its implementation in a high-volume manufacturing environment resulted in a reduction of misprocessed wafers, shorter equipment downtime, higher throughput, enhanced process visibility, and yield improvement. Along with optimizing FDC capabilities, implementing a short loop sampling plan reduced the turnaround time for early electrical characterization by a factor of four; this allowed for timely inline adjustments within the fabrication process to tighten the statistical process control (SPC) over the distribution of the process control monitor (PCM) TaN resistor value and improve thin film uniformity. [ABSTRACT FROM AUTHOR]

Semiconductor manufacturing has been extensively exploiting machine-learning (ML) to process equipment sensory data (ESD) for near-real time anomaly detection (AD). ESD characteristics are highly diversified and data lengths vary among processing steps and cycles. Cleansing ESD with minimum distortion (CMD) to fit the fixed-length input requirement by ML-based AD is critical to AD effectiveness and is challenging. This paper presents a novel CMD method of four innovations: i) statistical mode-based equalization of step data lengths for the least number of step data length changes, ii) importance indicator value (IIV) of a data sample based on its relative difference with the subsequent sample, and iii) step data segmentation into groups based on samples of significant IIVs and the least-entropy-group-to-cleanse-first rule, and iv) cleansing the least IIV sample(s) in the selected group for step data length equalization. CMD application to ESD demonstrates its characteristics preservation property. Simulation experiments are on an integration of data cleansing with an unsupervised ML-based AD system, STALAD. Comparisons with two benchmark methods over AD scenarios of small-scale drifts and shifts show that CMD not only is superior in facilitating accurate detection by STALAD but also helps detect anomaly much earlier than using the two benchmarks. [ABSTRACT FROM AUTHOR]

Prospective authors are requested to submit new, unpublished manuscripts for inclusion in the upcoming event described in this call for papers. [ABSTRACT FROM AUTHOR]

The signal-to-noise ratio of optical emission spectroscopy (OES) data has decreased as the plasma etching process has advanced. As a result, not only the advanced endpoint detection method was required, but also the selection of more informative wavelengths. This paper proposes an improved endpoint detection algorithm by combining data-driven wavelength selection and a Gaussian mixture model (GMM). The data-driven wavelength selection algorithm finds the correlation between training data and a sigmoid function of time. Then, using the fitted GMM of the training data in latent space, the endpoint of the test data is determined in real-time. The proposed algorithm’s performance was evaluated using real OES data, comprised of seven operations. The correlation-based wavelength selection algorithm significantly reduced detection error by 70.2% when compared to the conventional method, which selects a few wavelengths manually based on prior knowledge. Additionally, the GMM detection method clustered OES data from low open area wafers much more clearly than the recently proposed method using GMM. This demonstrates that combining correlation-based wavelength selection with GMM is an effective method for detecting endpoints during plasma etching of small open area wafers. [ABSTRACT FROM AUTHOR]