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The annual output value of Taiwan’s wafer foundry and IC packaging test ranks first worldwide. The electronics industry has a complete industrial ecological chain in the supply chain system of global information and communication technology. In order to increase market competitiveness and increase the operational flexibility, manufacturing process outsourcing has become a trend in the business model of the electronics industry. The quality of the outsourcing affects the quality and function of the final product, the outsourcer selection is crucial to ensure the quality of the final product. This article takes the wire bonding process as an example, and proposes a fuzzy selection model of quality-based IC packaging process outsourcers. Then, this article selects the six standard deviation indicator that can fully reflect the process yield and quality level as the evaluation tool. Since the indicator contains unknown parameter, in order to improve the accuracy of estimation and overcome the uncertainty of measurement data, this paper applies mathematical programming to derive the confidence interval of six sigma quality index, and proposes a confidence-interval-based fuzzy testing meth as a green outsourcer selection tool to reduce the risk of misjudgment due to sampling errors and improve the accuracy of the selection. [ABSTRACT FROM AUTHOR]

In the semiconductor manufacturing industry the development of single index assessing the equipment health condition is urgent, and thus the dashboard can be used for monitoring thousands of equipment. This paper proposes a novel equipment health index (EHI) framework and a Hotelling T-squared index (HTI) to monitor equipment and support preventive maintenance in real time in the semiconductor manufacturing industry. The EHI framework consists of data preprocessing, statistical process control, analytic hierarchy process, and a comprehensive single index representing the health condition of equipment. It considers different types of the univariate control charts for each status variable identification (SVID), and aggregates the scores corresponding to the control charts throughout the hierarchical structure. The HTI considers the correlation among the selected SVIDs and builds a multivariate index by using Hotelling T-squared statistic. An empirical study of Taiwan’s leading semiconductor assembly manufacturer finds that both the EHI and the HTI supported monitoring thousands of pieces of equipment in real time. In practice, firms can rapidly troubleshoot the root causes of failures by the decomposition of EHI. [ABSTRACT FROM AUTHOR]