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Highly efficient machining of SiCp/Al composites is always a challenge due to their poor surface integrity. This paper aims to study the cutting mechanism considering the interaction between particles and reveals the removal process of SiC particles under different cutting parameters. Furthermore, a thorough analysis was conducted to examine the impact of SiC particles on cutting force, chip shape, and surface defects. The results indicate that the form of particle removal is determined by the relative position of the cutting path and SiC particles, which includes particle fracture, push-in, slip, and debonding. As the cutting depth increases, the cutting force also increases from 10.4 to 20.1 N, and the presence of SiC particles can cause significant fluctuations in the cutting force. In addition, an increase in cutting speed improves surface quality, and the chips primarily exhibit a block- and sheet-like shape. This study provides valuable insights into the removal mechanism and process research of SiCp/Al composites. [ABSTRACT FROM AUTHOR]

Fused silica glass and other hard and brittle materials are widely used in optical components, microfluidic chips and other fields, which have the characteristics of high hardness, low ductility, and difficult processing. Using traditional milling method not only causes tool wear, but also causes the surface and sub-surface damage of components, which seriously affects the quality of components. In order to improve the surface quality and processing efficiency, laser-assisted micro-milling process is proposed in this paper. Using laser as a material softening tool, the ductility domain of the material can be enlarged, and the surface roughness of the fused silica workpiece can be effectively improved. In this paper, through the method of finite element simulation and experiments, the relationship between laser parameters and processing temperature of fused silica elements is calculated, and several groups of laser parameters are selected as experimental parameters. The experimental results shows that the surface roughness of fused silica workpiece can be effectively reduced to 51 nm, and the tool wear width can be reduced to 3.8 μm after laser assisted. [ABSTRACT FROM AUTHOR]

When inductively coupled plasma (ICP) is used as a machining tool, its chemical etching-based processing method has the advantage of no contact stress between the tool and the material, thus without any mechanical damage. In recent years, this issue has been widely concerned in optical fabrication. However, there are many differences between low power ICP jet and conventional ICP jet, one of which is that the former does not easily form a rotation-symmetric removal function due to its obvious pinch effect. In this research, the electromagnetism principle of the plasma pinch effect was analyzed firstly, and the jet shape under the pinch effect was classified. Then, experiment was carried out to investigate the plasma jet shape under the pure Ar and mixed gas of CF4-Ar, and the influence law of the reaction gas on the jet propagation shape was analyzed. Finally, the rotational symmetry of the removal function of plasma jet processing was optimized, and the nozzle design criteria were proposed based on pinch effect. [ABSTRACT FROM AUTHOR]

Surface measurement is essential to enhance accuracy and efficiency in ultra-precision machining. In order to increase the measurement availability and efficiency, offline lab-based solutions are shifting towards the use of surface metrology upon manufacturing platforms. With the lack of remounting errors, on-machine surface measurement (OMSM) allows the deterministic assessment of manufactured surfaces just-in-time and also provides valuable feedback to the process control of ultra-precision machining. This paper is aimed at reviewing the state-of-the-art OMSM and applications in the ultra-precision machining process. The benefits and considerations on the integration of metrology are discussed. The merits and limitations among different OMSM types are compared as well. Finally, the challenges and outlook of the ultra-precision machining-metrology integration are highlighted. [ABSTRACT FROM AUTHOR]