1. Research on subsurface damage mechanism and suppression method of ultrasonic vibration–assisted grinding of sapphire components under extreme service environment.
- Author
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Sun, GuoYan, Zhang, Wanli, Wang, JianYong, Ding, JiaoTeng, Wang, Bo, and Shi, Feng
- Subjects
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KRIGING , *ACOUSTIC emission , *BRITTLE materials , *EXTREME environments , *ULTRASONIC effects , *SAPPHIRES - Abstract
Single-crystal sapphire (α-Al2O3) has a wide range of applications in a variety of extreme environments due to its excellent mechanical and chemical properties as well as its stability under extreme service conditions. In addition, sapphire is a hard and brittle material, which makes it difficult to avoid the introduction of subsurface damage during processing, and the existence of a subsurface damage layer seriously affects the performance of the optical system. Therefore, this study focuses on the mechanism of subsurface damage in sapphire grinding, the suppression of damage depth, and the accurate and fast prediction of damage depth. A subsurface damage model for ultrasonic vibration–assisted grinding of sapphire was established by combining ultrasonic vibration single abrasive grain kinematics and dynamics analysis. The mechanism of ultrasonic vibration–assisted grinding was investigated by combining force and acoustic emission (AE) signals. And the effects of ultrasonic vibration–assisted grinding on the surface quality, subsurface damage form, and depth were analyzed. A comprehensive prediction model of SSD based on surface roughness (Sz) was established by combining indentation fracture mechanics and Gaussian process regression. Finally, by analyzing the influence law of each process parameter on the subsurface damage depth (SSD), the grinding process parameters were optimized, and the subsurface damage suppression strategy was proposed. This study provides theoretical guidance for the high-efficiency and low-damage grinding of sapphire. [ABSTRACT FROM AUTHOR]
- Published
- 2024
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