1. A comparative study on hot deformation and solid-state bonding behavior of aluminum alloys for the integration of solid-state joining and forming processes.
- Author
-
Yu, Junquan, Zhao, Guoqun, Chen, Xiaoxue, and Liang, Mengchao
- Subjects
- *
JOINING processes , *ALUMINUM alloys , *ISOTHERMAL compression , *STRESS-strain curves , *STRAIN rate , *INTERFACIAL bonding - Abstract
For improving production efficiency and saving energy, various manufacturing technologies for integrating solid-state joining and plastic forming processes have become hot topics in recent years. Hot deformation and solid-state bonding of materials are essences for the integration of solid-state joining and plastic forming processes. This study compared the hot deformation and solid-state bonding behavior of an Al-Mg-Si alloy at the temperatures ranging from 673 to 803 K and the strain rates ranging from 0.001 to 10 sā1 using conventional hot isothermal compression tests (CHICT) and hot isothermal compression bonding tests (HICBT). The flow stress behavior of the material during CHICT and HICBT was compared, and a constitutive equation was established based on the true stress-strain curves obtained from HICBT. The evolution of grain structure and bonding interface in the processes of hot deformation and solid-state bonding was investigated. Furthermore, the quantitative relationship between the interfacial bonding degree and the temperature and strain rate was established, and the relationship between the bonding degree and the mechanical properties of the welds was discussed. A new parameter, RSS, was proposed to evaluate the solid-state weldability of materials. [ABSTRACT FROM AUTHOR]
- Published
- 2019
- Full Text
- View/download PDF