1. Electrochemical micro texturing on flat and curved surfaces: simulation and experiments.
- Author
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Patel, Divyansh Singh, Jain, V. K., Shrivastava, Ankit, and Ramkumar, J.
- Subjects
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MICROMACHINING , *CURVED surfaces , *COMPUTER simulation , *MICROFABRICATION , *MICROSTRUCTURE - Abstract
Laser surface texturing and through-mask electrochemical micromachining (TMECMM) are some of the commonly used methods which include multiple steps to achieve micro-textures. However, for large-area applications, it is desirable to have an economical single-step process. In this regard, ECMM is expected to be a promising and economically viable micro-texturing process for micro-manufacturing industries. This paper proposes a novel maskless EC micro-texturing process using tool sinking technique with low voltage and short pulses. Methodology of using edges (∼30 μm each) of printed circuit boards (PCBs) for ECMM of micro-channels and micro-pillars is a unique one. Micro-pillars, micro-dimples and micro-channels are produced through a direct electrochemical cathode sinking process. Analysis of current density and prediction of width and depth of micro-dimples on a flat stainless steel surface are studied through 2D numerical simulation carried out on COMSOL 4.3a. The proposed method implies the use of less toxic electrolyte, low voltage (1-6 V), short pulses (5 to 50 μs) and selective polymer coating on the tool (cathode). A series of experiments of EC sinking for creating various micro-patterns and micro-structures has been carried out on the flat as well as curved metallic surfaces. This paper reports machining of micro-dimples of 200-300 μm diameter, micro-channels of 150-250 μm and square micro-pillars of 300-350 μm. Comparison of the predicted geometrical dimensions of the micro-dimples through the simulation shows reasonable agreement with the experimental results for the given process parameters of ECMM. The paper also reports a brief comparison of laser surface texturing (LSTex) and electrochemical surface texturing (ECSTex). [ABSTRACT FROM AUTHOR]
- Published
- 2019
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