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Abstract: High interfacial stresses near the ends of adherends are responsible for debonding failure of bonded joints used extensively in structural engineering and microelectronics packaging. This paper proposes a stress-function variational method for determination of the interfacial stresses in a single-sided strap joint subjected to mechanical and thermal loads. During the process, two interfacial shear and normal (peeling) stress functions are introduced, and the planar stresses of adherends of the joints are expressed in terms of the stress functions according to the static equilibrium equations. Two coupled governing ordinary differential equations (ODEs) of the stress functions are obtained through minimizing the complementary strain energy of the joints and solved explicitly in terms of eigenfunctions. The stress field of the joints based on this method can satisfy all the traction boundary conditions (BCs), especially the shear-free condition near the adherend ends. Compared to results based on finite element method (FEM) and other analytic methods in the literature, the present variational method is capable of predicting highly accurate interfacial stresses. Dependencies of the interfacial stresses upon the adherend geometries, moduli and temperature are examined. Results gained in this study are applicable to scaling analysis of joint strength and examination of solutions given by other methods. The present formalism can be extended conveniently to mechanical and thermomechanical stress analysis of other bonded structures such as adhesively bonded joints, composite joints, and recently developed flexible electronics, among others. [Copyright &y& Elsevier]

The complex stress intensity factor and energy release rate are obtained for two semi-infinite interfacial cracks between two bonded dissimilar elastic strips with equal thickness under inplane deformations. During the procedure, by means of conformal mapping technique, the mixed boundary-value problem is reduced to a standard Riemann–Hilbert problem, which is further solved in closed-form. In some limiting cases, the present explicit solutions can cover the well-known results in the literature. [Copyright &y& Elsevier]

Interface and interfacial cracks interacting with screw dislocations in piezoelectric bimaterials subjected to antiplane mechanical and in-plane electrical loadings are studied within the framework of linear piezoelectricity theory. Straight dislocations with the Burgers vector normal to the isotropic basal plane near the interface or interfacial crack are considered. The dislocations are characterized by a discontinuous electric potential across the slip plane and are subjected to a line-force and a line-charge at the core. An explicit solution for the screw dislocation in piezoelectric bimaterial with straight interface is found based on the solution of a similar problem for infinite homogenous medium. The obtained relation is independent of the nature of singularity. This fundamental result is used to analyze dislocation interacting with a set of collinear interfacial cracks in piezoelectric bimaterials. Three solutions for the screw dislocation interacting with a semi-infinite crack, finite crack, and edge crack between two bonded dissimilar piezoelectric materials are obtained in closed-form. These solutions can be used as Green’s functions for the analyses of interfacial cracks in piezoelectric bimaterials. [Copyright &y& Elsevier]

This paper is concerned with the problem of plastic zone at the tip of an edge crack in an isotropic elastoplastic strip under anti-plane deformations. By means of complex potential and Dugdale model, the stress intensity factor and the size of plastic zone are obtained in closed-form. Furthermore, the analytic solutions for an edge crack at the free boundary of a half-space and a semi-infinite crack heading towards a free surface are determined as the limiting cases of the strip geometries. [Copyright &y& Elsevier]