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1. Heat transfer analysis at high cooling rate on the surface of thermoplastic parts.

2. Discussions of some myths and concerned practices of film cooling research

3. A ghost-cell immersed boundary method for simulations of heat transfer in compressible flows under different boundary conditions.

4. Investigation of dual-phase-lag heat conduction model in a nanoscale metal-oxide-semiconductor field-effect transistor

5. Investigation of the 3D model of coupled heat and liquid moisture transfer in hygroscopic porous fibrous media