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• The void defects significantly affect the deformation and plasticity in FeNiCrCoCu HEAs. • The deformation behavior reveals that the void is the main cause of initial strain. • The effects of different temperatures and strain rates on FeNiCrCoCu HEAs voids were explored. • The tensile strength significantly increases at a strain rate of 1010 s−1 compared to 109 and 108 s−1. While preparing and using high entropy alloys (HEAs), many defects such as voids are inevitably formed. The effects of voids on the mechanical properties of FeNiCrCoCu HEAs are investigated using molecular dynamics simulations. The evolution of voids is examined by using models with one or two voids considering different void sizes, applied strain rates, and temperatures. The results demonstrate that the existence of the voids does influence the mechanical properties of HEAs. The tensile strength of the single-void model is higher than that of double-void model. The stress–strain curves demonstrate that a larger initial void size could reduce the tensile strength. During the tensile deformation, all dislocation emission occurs initially from the surface of the void. However, it occurs between the two voids in double-void models, which causes the deformation of the voids. With temperature increases, the tensile strength decreases. Under various strain rates, the tensile strength slightly rises at strain rates ranging from 108to 109 s−1. However, it significantly increases at a strain rate of 109 to 1010 s−1. [Display omitted] The development of void defect in FeNiCrCoCu HEAs under the tensile process at 300 K and a strain rate of 109 s−1. (a) single-void model; (b) double-void model. [ABSTRACT FROM AUTHOR]