1. Rapid Prototyping Tape Stencils for the Application of Solder Paste
- Author
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Mimi X. Yang, H.-S. Philip Wong, Karen M. Dowling, and Debbie G. Senesky
- Subjects
Rapid prototyping ,Printed circuit board ,Materials science ,Laser cutting ,Soldering ,Automotive Engineering ,Bead probe technology ,Solder paste ,Composite material ,Stencil ,Flip chip - Abstract
This works describes a promising method for rapid prototyping tape stencils for the application of solder paste. This process is appropriate for research settings requiring developmental flexibility and the ability to deal with small device dies. This work compares the volume of solder paste deposited versus aperture volume for several common tape materials and several common printed circuit board (PCB) stencil materials. The solder deposits are then reflowed to identify which aperture and solder paste parameters can generate successful solder bumps. Electrically conductive solder bonds for small bond pads (100 μm and larger) are demonstrated between silicon device dies and glass dies using this process.
- Published
- 2017
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