6 results on '"Kim, Hyoungjae"'
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2. Kinematical Modeling of Pad Profile Variation during Conditioning in Chemical Mechanical Polishing
3. Experimental Investigation of Material Removal Characteristics in Silicon Chemical Mechanical Polishing
4. Effect on Two-Step Polishing Process of Electrochemical Mechanical Planarization and Chemical–Mechanical Planarization on Planarization
5. Effect of Process Parameters on Friction Force and Material Removal in Oxide Chemical Mechanical Polishing
6. Chemical Mechanical Planarization Method for Thick Copper Films of Micro-Electro-Mechanical Systems and Integrated Circuits
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