1. Low-Temperature Fabrication of Nickel Silicide Metal Oxide Semiconductor Capacitors at 280 °C by Metal Chloride Reduction Chemical Vapor Deposition
- Author
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Shigetoshi Ohshima, Yoshihiko Mitake, Fumihiko Hirose, Masaru Watanabe, Naoki Oyama, Shinichi Nagase, Hitoshi Sakamoto, Naoto Fujiwara, Tomita Yugo, and Yuzuru Ogura
- Subjects
Materials science ,Physics and Astronomy (miscellaneous) ,Inorganic chemistry ,General Engineering ,Analytical chemistry ,General Physics and Astronomy ,chemistry.chemical_element ,Chemical vapor deposition ,Substrate (electronics) ,engineering.material ,Nickel ,chemistry.chemical_compound ,Polycrystalline silicon ,chemistry ,X-ray photoelectron spectroscopy ,Silicide ,engineering ,Wafer ,Metal gate - Abstract
We have successfully fabricated nickel silicide metal–oxide–semiconductor (MOS) capacitors at 280 °C by metal chloride reduction chemical vapor deposition (MCR-CVD). In this process, we first prepared polycrystalline silicon (poly-Si)/SiO2-overcoated Si wafers and exposed the wafers to Cl plasma containing NiCl for 40 min with a substrate temperature of 280 °C. During this process, the top layer of poly-Si is changed to a nickel silicide film with the Ni concentration at approximately 50%. Depth-resolved X-ray photoelectron spectroscopy (XPS) showed a uniform profile of the top film and a sharp interface on the SiO2 surface at such Ni concentration. We have also obtained capacitance–voltage (C–V) characteristics using a MOS capacitor from the processed wafer. We demonstrate the possibility and applicability of MCR-CVD in the near room temperature (RT) fabrication of metal gate MOS capacitors.
- Published
- 2007
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