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Bonding technology is used as the main connection mode of coated structures of car interior trim, of which the process and structure are being continuously optimized. In this paper, ABAQUS software is applied to establish the finite element model of the bonded structure of the dash panel. Based on the cohesive zone model (CZM) method, the damage and failure process of surface joints under different displacement loading conditions are numerically simulated. The effectiveness of the finite element model based on CZM for the numerical simulation of the damage and failure processes of bonded surface joints is verified from the perspectives of the numerical calculation method, experimental verification, and numerical result analysis. The results show that the finite element model based on CZM theory can effectively simulate and evaluate the damage and failure processes of multiphase polymers or composite surface joints. By obtaining the load‒displacement curves, the stress nephogram and the damage nephogram, the dynamic processes of damage initiation, damage evolution and failure of the surface joint are observed and analysed, and the bonding strength of the interlayer model is also compared and analysed. Compared with the bonding interface between the skin and cloth, the bonding interface between the frame and cloth is less prone to damage. [ABSTRACT FROM AUTHOR]

Accelerating the polymerisation of adhesives has been a long-established field of research in context of adhesive bonding technology as long curing times – sometimes up to days – represent a decisive disadvantage in contrast to most mechanical joining techniques like riveting or screwing. In addition to, e.g., curing via UV, microwave or IR radiation, electromagnetic induction represents a promising solution for speeding up the cure of polymers. With this method, adhesively bonded components are subjected to an alternating electromagnetic field (EMF) that induces heat in EMF-sensitive materials, e.g., steel or aluminium. If intrinsic EMF-sensitivity of the materials to be bonded is not given, different types of susceptors like meshes, fibres or particles are added to the adhesive in order to be heated inductively and thus cure the adhesive from the inside. Recent research has focused on a special type of susceptors, so-called Curie particles (CP), which can only be heated inductively up to their specific Curie temperature (Tc) at which CP-induced heating automatically stops. As a result, a curing process is created that eliminates the need for external temperature monitoring while simultaneously preventing overheating of the bond. As underlying curing kinetics – most importantly polymerisation enthalpy and curing time – significantly differ depending on the considered adhesive, induction times needed to achieve full cure must currently be determined through costly preliminary investigations on an experimental level. Thus, to contribute for a more efficient and controllable bonding process, the present study aimed at developing a numerical model based on the Finite Element Method (FEM) and capable of predicting the curing degree α in dependency of curing temperature profiles TCure(t) and the CP content ccp. For this purpose, the curing kinetics of two fundamentally different 2K epoxy adhesives were linked to a transient heat flow simulation based upon experimentally determined heat loads. The validation of the developed FEA technique was successfully carried out using the example application of inductively cured large-scale Glued-in rod (GiR) specimens, whereby experimentally determined temperature profiles showed excellent agreement with the numerical predictions. The present paper focused on presenting preliminary experimental work as well as all analytical methods implemented for the numerical modelling. [ABSTRACT FROM AUTHOR]