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In this work, a novel soybean oil-based urethane acrylate polyol called ADSO was synthesized by the condensation reaction of hydroxyethyl acrylate modified isophorone diisocyanate with chlorinated soybean oil (SOL). The soybean oil-based waterborne polyurethane called ADSO-WPU was prepared with SOL and ADSO as polyols. Using the carbon-carbon double bonds of ADSO-WPU as reaction sites, methyl methacrylate (MMA), butyl methacrylate (BA) and 2-(perfluorohexyl)ethyl methacrylate (PFOMA) were grafting copolymerized to obtain the soybean oil-based waterborne polyurethane grafted fluorine-containing acrylate (ADSO-PUA). The results of Fourier transform infrared spectrometer, dynamic light scattering analyzer and transmission electron microscopy showed that the grafted copolymer latex was successfully prepared with particle size of about 100–300 nm. Furthermore, effects of the ratio of PFOMA, MMA and BA on properties of grafted copolymer films were studied. Compared with ADSO-WPU film, ADSO-PUA film had significantly lower water absorption, higher hardness, better mechanical properties and higher thermal stability. With the increase of PFOMA content, the water absorption rate decreased from 108% to about 10%, the hardness increased from 4H to 6H, and the tensile strength increased from 3.05 MPa to 9.79 MPa. [ABSTRACT FROM AUTHOR]

In this work, the isocyanate terminated castor oil based urethane oligomer (CO-IPDI) was prepared by the reaction of castor oil and isophorone diisocyanate (IPDI) without adding any organic solvent. After the acrylic copolymer pressure sensitive adhesive (PSA) was heated at 80 °C for 20 min, it was mixed with CO-IPDI, trifunctional acrylic monomer and photo-initiator in a certain proportion to give a UV-curable peelable adhesive for silicon wafer cutting process. Before UV irradiation, the acrylate copolymer chains were cross-linked by CO-IPDI to form a network. After UV irradiation, another polymer network formed by photo-polymerization of trifunctional acrylic monomer hold together with it to form an interpenetrating network (IPN) structure. The results showed that this IPN structured UV-curable peelable PSA had a high peeling strength of 13.99 N/25 mm before UV curing to meet the suggested requirements for silicon wafer cutting process. The peeling strength was significantly decreased to 0.49 N/25 mm after UV curing, and the tape was easily peeled off from wafer with about 0.96% residual adhesive estimated by the area ratio of all residual adhesive particles to silicon wafer observed by scanning electron microscopy. This work provides a new candidate idea for green and efficient preparation of UV-curable peelable PSA. [ABSTRACT FROM AUTHOR]