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Electrodeposition of metals and alloys in ionic liquids has been employed in a broader range of fields. Issues regarding the evolution of hydrogen, toxicity of reagents can be overcome by utilizing ionic liquids. This review outlines the current state of electrodeposition of various types of metals and their alloys in ionic liquids with particular focus on the work within the last decade. The metals are categorized into four groups and special attention is paid to the reactive metals that cannot possibly be deposited from traditional aqueous solutions. [ABSTRACT FROM AUTHOR]

Highlights: [•] SiC particles were coated with α-Al2O3 by sol–gel technology. [•] The Ni/CSp composite was fabricated by electrodeposition. [•] The yield strength of Ni/CSp was increased by more than six times of pure Ni at 600°C. [•] SiC enhanced strength by inhibiting grain growth and interacting with dislocations. [•] Cracking of coated particles demonstrated the result of load transfer strengthening. [ABSTRACT FROM AUTHOR]

Abstract: The relationship between surface functional groups and electrochemical behaviors of polyacrylonitrile (PAN)-based carbon fibers (CFs) differentiated by oxidation treatment in air was studied. The chemical character of the CFs surface was estimated by X-ray photoelectron spectroscopy (XPS) and the electrochemical behavior of treated CFs in CuSO4 plating solution was studied by electrochemical setup. The influence of functional groups on the morphology of copper deposits was characterized by field-emission scanning electron microscopy (FESEM). It was found that the O/C atomic ratio rose rapidly from 23.05% (as-received carbon fibers) to 42.83% as the oxidation temperature was increased to 400°C and the content of –C highest. Concentrations and types of the functional groups on CFs surface showed a close connection with the electrochemical response of CFs in CuSO4 plating bath. It was showed that Cu electrodeposition was the interaction of applied voltage and the reduction of surface functional groups. With the functional groups increased, the quantities of the Cu nuclei increased, further the morphology of deposited Cu was affected. [Copyright &y& Elsevier]