1. Electroless copper plating of tungsten powders and preparation of WCu20 composites by microwave sintering
- Author
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Sivasankar Koppala, Hongying Xia, Chandrasekar Srinivasakannan, Langlang Wang, Lei Xu, and Zhaohui Han
- Subjects
Materials science ,020502 materials ,Mechanical Engineering ,Metals and Alloys ,Sintering ,chemistry.chemical_element ,02 engineering and technology ,Tungsten ,021001 nanoscience & nanotechnology ,Microstructure ,Copper ,Surface coating ,chemistry.chemical_compound ,0205 materials engineering ,chemistry ,Mechanics of Materials ,Materials Chemistry ,Tartaric acid ,Copper plating ,Relative density ,Composite material ,0210 nano-technology - Abstract
In the present work, tungsten powders coated with copper by electroless plating method, and preparation of WCu20 composites by microwave sintering with copper-coated tungsten powder as raw material. The result shows that at the situation of a temperature of 60 °C, pH value of 12–13, with formaldehyde solution (53 ml/L) as reducing agent, iron potassium cyanide solution (0.3 g/L) as stabilizer, tartaric acid potassium sodium (15 g/L) and EDTA-2Na (19 g/L) mixture solution as compound complexing agent, the thickness of surface coating was relatively uniform, which is around 0.6–1.1 μm. The WCu20 composites were fabricated by microwave sintering with copper-coated tungsten powder as raw material shows uniform microstructure distribution, relatively high density. The hardness of the WCu20 composites increased with the temperature. While the temperature of sintering at 1100 °C for 1 h, the density could be up to 15.22 g/cm3, relative density was 97.13%, which shows better properties.
- Published
- 2018
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