8 results on '"Chen, Chuantong"'
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2. Enhancing thermal-mechanical performance of micron Ag/ZrW2O8 nanorod die-attach paste with low thermal expansion
3. Interface reaction and evolution of micron-sized Ag particles paste joining on electroless Ni-/Pd-/Au-finished DBA and DBC substrates during extreme thermal shock test
4. Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air
5. Effect of electroplated Au layer on bonding performance of Ag pastes
6. Electrochemical behavior of Zn-xSn high-temperature solder alloys in 0.5 M NaCl solution
7. Effect of oxygen on microstructural coarsening behaviors and mechanical properties of Ag sinter paste during high-temperature storage from macro to micro
8. Robust bonding and thermal-stable Ag–Au joint on ENEPIG substrate by micron-scale sinter Ag joining in low temperature pressure-less
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