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Growth mechanism of ScN on Sc2O3 for integration of Ga-polar GaN on Si(111) is investigated by in-situ X-ray photoemission spectroscopy, ex-situ time-of-flight secondary ion mass spectrometry, atomic force microscopy, and ab-initio density functional theory (DFT) calculations. The ScN films are grown by molecular beam epitaxy from e-beam evaporated Sc and N plasma. The films grow in a layer-by-layer (Frank-van der Merwe, FM) fashion. Diffusion of nitrogen into Sc2O3 and segregation of oxygen onto ScN are observed. The segregated O atoms are gradually removed from the surface by N atoms from the plasma. Experiment and theory show that nitrogen cannot be efficiently incorporated into Sc2O3 by exposing it to N plasma alone, and calculations indicate that anion intermixing between ScN and Sc2O3 should be weak. On the basis of ab-initio data, the indiffusion of N into Sc2O3 is attributed mostly to the effect of interaction between ScN ad-dimers on the Sc2O3 surface in the initial stage of growth. The segregation of O to the ScN surface is understood as driven by the tendency to compensate build-up of the electric field in the polar ScN film. This segregation is computed to be energetically favorable (by 0.4 eV per O atom) already for a monolayer of ScN; the energy gain increases to 1.0 eV and 1.6 eV per O atom for two and three ScN layers, respectively. Finally, it is verified by DFT that the ScN deposition method in which Sc metallic film is deposited first and then nitridized would lead to strong incorporation of O into the grown film, accompanied by strong reduction of the Sc2O3 substrate. [ABSTRACT FROM AUTHOR]

Based on a novel double step oxide buffer heterostructure approach for GaN integration on Si, we present an optimized Metal-Semiconductor-Metal (MSM)-based Ultraviolet (UV) GaN photodetector system with integrated short-period (oxide/Si) Distributed Bragg Reflector (DBR) and leakage suppressing Metal-Oxide-Semiconductor (MOS) electrode contacts. In terms of structural properties, it is demonstrated by in-situ reflection high energy electron diffraction and transmission electron microscopy-energy dispersive x-ray studies that the DBR heterostructure layers grow with high thickness homogeneity and sharp interface structures sufficient for UV applications; only minor Si diffusion into the Y2O3 films is detected under the applied thermal growth budget. As revealed by comparative high resolution x-ray diffraction studies on GaN/oxide buffer/ Si systems with and without DBR systems, the final GaN layer structure quality is not significantly influenced by the growth of the integrated DBR heterostructure. In terms of optoelectronic properties, it is demonstrated that-with respect to the basic GaN/oxide/Si system without DBR-the insertion of (a) the DBR heterostructures and (b) dark current suppressing MOS contacts enhances the photoresponsivity below the GaN band-gap related UV cut-off energy by almost up to two orders of magnitude. Given the in-situ oxide passivation capability of grown GaN surfaces and the one order of magnitude lower number of superlattice layers in case of higher refractive index contrast (oxide/Si) systems with respect to classical III-N DBR superlattices, virtual GaN substrates on Si via functional oxide buffer systems are thus a promising robust approach for future GaN-based UV detector technologies. [ABSTRACT FROM AUTHOR]

Simultaneous and locally resolved determination of the mechanical stress variation and the free hole concentration using Raman spectroscopy is demonstrated in laser crystallized amorphous silicon layers. Such layers are often used for the fabrication of thin film solar cells, e.g., on borosilicate glass substrates. The combined effects of stress and doping on the Raman signal can be separated based on the use of three wavelengths in the visible. The results show that the free hole concentration in the samples investigated varies between 1×1018 and 1.3×1019 cm-3. Stress as well as the free hole concentration vary substantially within the sample. The stress level varies between 575 and 850 MPa (±12 MPa). Cross-sectional transmission electron microscopy images show the presence of extended lattice defects such as dislocations and grain boundaries in the crystallized Si layer which could account for the lateral stress variations detected by Raman spectroscopy. The impact of film inhomogeneity in terms of stress and doping on the performance of a solar cell will be discussed. [ABSTRACT FROM AUTHOR]

In this study, we present theoretical and experimental results regarding highly conductive modulation doped composition graded p-AlGaN/(AlN)/GaN multiheterostructures. Based on simulation results, several multiheterostructures were grown by metalorganic vapor phase epitaxy. Using high resolution x-ray diffraction and x-ray reflectometry, the abruptness of the AlGaN/AlN/GaN interfaces could be determined. Using electron holography, the energetic profile of the valence band could be measured, yielding important information about the vertical carrier transport in such multiheterostructures. The electrical properties of the samples were investigated by measuring the lateral (σL) and vertical (σV) conductivity, respectively. The free hole concentration of a sample optimized in terms of lateral conductivity was measured to be 1.2×1019 cm-3 (295 K) with a mobility of 7 cm2/V s, yielding a record σL of 13.7 (Ω cm)-1. Low temperature Hall measurements (77 K) proved the existence of a two-dimensional hole gas at the AlN/GaN interface, as the lateral conductivity could be increased to 30 (Ω cm)-1 and no carrier freeze out was observable. By substituting the p-GaN layer in a light emitting diode (LED) with an AlGaN/GaN multiheterostructure, the overall voltage drop could be reduced by more than 100 mV (j=65 A/cm2). Furthermore improved current spreading on the p-side of LEDs with integrated AlGaN/AlN/GaN multiheterostructures could be proved by μ-electroluminescence, respectively. [ABSTRACT FROM AUTHOR]