1. Kinetics of sulfide ion adsorption at copper amalgam electrode
- Author
-
Anna Basa, Tadeusz Krogulec, and Andrzej S. Baranski
- Subjects
chemistry.chemical_classification ,Sulfide ,General Chemical Engineering ,Activated complex ,Inorganic chemistry ,chemistry.chemical_element ,Copper ,Analytical Chemistry ,Mercury (element) ,Adsorption ,Reaction rate constant ,chemistry ,Desorption ,Electrochemistry ,Voltammetry - Abstract
Convolutive voltammetry was employed in studies of the kinetics of sulfide ion adsorption at copper amalgam and mercury electrodes. Measurements were carried out for low electrode coverages to minimize the effect of the lateral interaction energy, and the results were extrapolated to zero coverage. In the case of a Cu amalgam electrode (7.4×10−4 mol dm−3 of Cu) kinetic and thermodynamic parameters of the adsorption/desorption process were determined in solutions of different pH (3.6 to 12.8). For pH
- Published
- 1999
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