1. Laser polishing of ground aluminum surfaces with high energy continuous wave laser
- Author
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Steffen Mürdter, Markus Hofele, Harald Riegel, and Bahrudin Burzic
- Subjects
0209 industrial biotechnology ,Materials science ,business.industry ,Metallurgy ,Biomedical Engineering ,Polishing ,Pulse duration ,02 engineering and technology ,Surface finish ,021001 nanoscience & nanotechnology ,Atomic and Molecular Physics, and Optics ,Electronic, Optical and Magnetic Materials ,020901 industrial engineering & automation ,Thermal conductivity ,Optics ,Surface roughness ,Continuous wave ,Disk laser ,0210 nano-technology ,business ,Instrumentation ,Beam (structure) - Abstract
Conventional polishing of components is a time- and labor-intensive process. Moreover, manual polishing mostly depends on the processor's abilities. In accordance with these and additional difficulties, there is a strong need for automatable and efficient variants. For this purpose, polishing by means of laser beam, which enables a contact free and automatable processing of surfaces, provides a promising alternative. This paper investigates the laser polishing of the aluminum alloy AlSi9MnMg. Aluminum poses a particular challenge for laser polishing, due to high level of reflection, high thermal conductivity, and high coefficient of thermal expansion. For the investigations, a disk laser with a maximum power of 4000 W was used. The processing took place with pulsed wave laser beam at a pulse frequency of 1000 Hz and a minimal pulse duration of 0.3 ms as well as a continuous wave laser beam. The beam guidance was done by 1D-scanner optics in a highly pure inert gas atmosphere. The samples were first genera...
- Published
- 2017
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