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Organic phase change materials (PCMs) have received increasing attention for their applications in the fields such as solar energy storage and thermal management. Low thermal conductivity is a major key issue that hinders their practical applications. It has become a research hotspot to investigate the three-dimensional (3D) network method to improve the thermal performance of organic PCMs compared with the traditional blending method. Thermally conductive fillers form a 3D network in the resin matrix, which can enrich the thermal conductive pathway and effectively enhance the thermal conductivity. This paper mainly summarizes the research progress, preparation methods and influencing factors of composite PCMs, focusing on the methods of constructing 3D thermal conductivity network. It is hoped to provide reference or suggestion for the preparation of novel PCMs. [ABSTRACT FROM AUTHOR]

Simply filling the metal foam as a thermally conductive filler into the polymer matrix can improve the thermal conductivity of the polymer matrix, but it still cannot greatly improve the thermal conductivity of the composites. In this paper, the epoxy resin/copper foam-nickel (EP/CF-Ni) composite thermal conductive material was prepared by a combination of electroplating and vacuum liquid impregnation. The deposition of nickel increases the heat dissipation area of the copper foam and at the same time widens the heat conduction path of the materials. By comparing EP/CF with different pores and EP/CF-Ni with different deposition times, it was found that the thermal conductivity of EP/CF-Ni composites could reach 5.215 W/(mK) at 7.3 wt% nickel deposition, which enhanced 2507% and 75% compared to pure epoxy and copper foam matrix composites, respectively. The deposition of nickel further improves the wear resistance of the composite. This experiment reveals the synergistic effect of thermal conductivity of metallic Ni and 3D copper foam, and provides some reference opinions for the field of thermal conductivity of metallic foam. [ABSTRACT FROM AUTHOR]