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In this paper, a hierarchical clustering selection based weighted random forests scheme is proposed for fault classification in complex industrial processes. Model diversity and the strength of each model are deemed to be two key issues for the performance of ensemble learning method. To improve the diversity between classification trees and the performance of individual classification trees in random forests, the hierarchical clustering method is applied for offline model selection in random forests, which can simultaneously reduce the online fault classification complexity. Meanwhile, the weighted voting rule is used in random forests instead of majority voting, in order to boost the good performance models and weaken the bad ones. Detailed comparative studies between proposed method and conventional methods have been carried out through the Tennessee Eastman (TE) benchmark process. [ABSTRACT FROM AUTHOR]

Abstract: In this paper a robust linear regression method with variable selection is proposed for predicting desirable end-of-line quality variables in complex industrial processes. The development of such prediction models is challenging because there is usually a large pool of candidate explanatory variables, limited sample data, and multicollinearity among explanatory variables. The proposed method is named as the enumerative partial least square based nonnegative garrote regression. It employs partial least square regression in enumerative manner to generate initial model coefficients and then uses a nonnegative garrote method to shrink original coefficients so that irrelevant variables can be eliminated implicitly. Analysis about the advantages of the proposed method is provided compared to existing state-of-art model construction methods. Two simulation examples as well as an industrial application in a local semiconductor factory unit are used to validate the proposed method. These examples witness substantial improvement in terms of accuracy and robustness in variable selection compared to existing methods. Specifically, for the industrial case the percentages of improvement in terms of root mean squared error is up to 24.3% compared with the previous work. [Copyright &y& Elsevier]

Abstract: In semiconductor manufacturing processes, mixed-products are usually fabricated on the same set of process tool with different recipes. Run-to-run controllers which based on the exponential weighted moving average (EWMA) statistic are probably the most frequently used in industry for the quality control of certain semiconductor manufacturing process steps. However, for mixed-product drifted process, if the break length of a product is large, then the process output at the beginning runs of each cycle will far deviate from the target value which will lead to a possible high rework rate and lots of waste wafers. Therefore, this study aims to develop a new approach named cycle forecasting EWMA (CF-EWMA) approach to deal with the problem of large deviations in the first few runs of each cycle. Furthermore, a common fault, i.e., the step fault, is also considered in this paper, and fault tolerant cycle forecasting EWMA (FTCF-EWMA) approach is proposed. Simulation study shows that the proposed approaches are effective. [Copyright &y& Elsevier]

Abstract: In this paper, an extension of the modified generalized predictive control (GPC) algorithm and a tuning strategy is presented. To take the plant dynamics such as under damped behavior and the effect of zeros into account, extension to the second order plus dead time (SOPDT) of the first order plus dead time (FOPDT) modified GPC method is proposed. It is shown that this method is computationally undemanding. Also, implementation is more straightforward than conventional GPC algorithms. Moreover, the proposed tuning strategy enables a fast implementation of the GPC with regard to nominal stability and desired performance. The simplicity of this strategy and its wide applicability makes it readily accessible to practitioners for utilization. Multiple simulation results are provided to show the effectiveness of the proposed algorithm. [Copyright &y& Elsevier]

Abstract: A new method is developed to estimate the minimum variance bounds and the achievable variance bounds for the assessment of the batch control system when the iterative learning control is applied. Unlike continuous processes, the performance assessment of batch processes requires particular attention to both disturbance changes and setpoint changes. Because of the intrinsically dynamic operations and the non-linear behavior of batch processes, the conventional approach of controller assessment cannot be directly applied. In this paper, a linear time-variant system for batch processes is used to derive the performance bounds from the routine operating batch data. The bounds at each time point computed from the deterministic setpoint and the stochastic disturbance for the controlled output variance can help create simple monitoring charts. They are used to track the progress easily in each batch run, to monitor the occurrence of the observable upsets, and to accordingly improve the current performance. The applications are discussed through simulation cases to demonstrate the advantages of the proposed strategies. [Copyright &y& Elsevier]

Abstract: This paper focuses on the modification of the PLS (partial least squares) modeling. The new method allows incorporation of a dEWMA (double exponentially weighted moving average) control algorithm into the standard run-to-run controller design for semiconductor processes. The resulting structure of the PLS model can extract the strongest relationship between the input and the output variables. It is particularly useful for inherent noise suppression. In addition, the resulting non-square MIMO control system can be decomposed into a multi-loop control system by employing pre-compensators and post-compensators of the PLS model, which is constructed from the input and output loading matrices. Subsequently, the conventional dEWMA controller can be separately and directly applied to each SISO control loop. The performance of the proposed method is illustrated through a chemical–mechanical polishing process in the manufacturing of the semiconductor. [Copyright &y& Elsevier]