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This paper proposed an X-band 6-bit passive phase shifter (PS) designed in 0.18 μ m silicon-on-insulator (SOI) CMOS technology, which solves the key problem of high integration degree, low power, and a small size T/R module. The switched-topology is employed to achieve broadband and flat phase shift. The ESD circuit and driver are also integrated in the PS. It covers the frequency band from 7.5 to 10.5 GHz with an EMS phase error less than 7.5°. The input and output VSWRs are less than 2 and the insertion loss (IL) is between 8-14 dB across the 7.5 to 10.5 GHz, with a maximum IL difference of 4 dB. The input 1 dB compression point (IP 1dB ) is 20 dBm.

A down-conversion in-phase/quadrature (I/Q) mixer employing a folded-type topology, integrated with a passive differential quadrature all-pass filter (D-QAF), in order to realize the final down-conversion stage of a 60 GHz receiver architecture is presented in this work. Instead of employing conventional quadrature generation techniques such as a polyphase filter or a frequency divider for the local oscillator (LO) of the mixer, a passive D-QAF structure is employed. Fabricated in a 65 nm CMOS process, the mixer exhibits a voltage gain of 7-8 dB in an intermediate frequency (IF) band ranging from 10 MHz-1.75 GHz. A fixed LO frequency of 12 GHz is used to down-convert a radio frequency (RF) band of 10.25-13.75 GHz. The mixer displays a third order input referred intercept point (IIP3) ranging from -8.75 to -7.37 dBm for a fixed IF frequency of 10 MHz and a minimum single-sideband noise figure (SSB-NF) of 11.3 dB. The mixer draws a current of 6 mA from a 1.2 V supply voltage dissipating a power of 7.2 mW.

This paper presents the design of a low power (LP) and a low noise figure (NF) quadrature demodulator with an on-chip frequency divider for quadrature local oscillator (LO) signal generation. The transconductance stage of the mixer is implemented by an AC-coupled self-bias current reuse topology. On-chip series inductors are employed at the gate terminals of the differential input transconductance stage to improve the voltage gain by enhancing the effective transconductance. The chip is implemented in 65-nm LP CMOS technology. The demodulator is designed for an input radio frequency (RF) band ranging from 10.25 to 13.75 GHz. A fixed LO frequency of 12 GHz down-converts the RF band to an intermediate frequency (IF) band ranging from DC to 1.75 GHz. From 10 MHz to 1.75 GHz the demodulator achieves a voltage conversion gain (VCG) ranging from 14.2 to 13.2 dB, and a minimum single-sideband NF (SSB-NF) of 9 dB. The measured third-order input intercept point (IIP 3 ) is -3.3 dBm for a two-tone test frequency spacing of 1 MHz. The mixer alone draws a current of only 2.5 mA, whereas the complete demodulator draws a current of 7.18 mA from a 1.2 V supply. The measurement results for a frequency divider, which was fabricated individually, prior to being integrated with the quadrature demodulator, in 65-nm LP CMOS technology, are also presented in this paper.

A dual-band, wide tuning range voltage-controlled oscillator that uses transformer-based fourth-order (LC) resonator with a compact common-centric layout is presented. Compared with the traditional wide band (VCO), it can double frequency tuning range without degrading phase noise performance. The relationship between the coupling coefficient of the transformer, selection of frequency bands, and the quality factor at each band is investigated. The transformer used in the resonator is a circular asymmetric concentric topology. Compared with conventional octagon spirals, the proposed circular asymmetric concentric transformer results in a higher quality-factor, and hence a lower oscillator phase noise. The VCO is designed and fabricated in a 0.18-μm CMOS technology and has 75% wide tuning range of 3.16–7.01 GHz. Depending on the oscillation frequency, the VCO current consumption is adjusted from 4.9 to 6.3 mA. The measured phase noises at 1 MHz offset from carrier frequencies of 3.1, 4.5, 5.1, and 6.6 GHz are −122.5, −113.3, −110.1, and −116.8 dBc/Hz, respectively. The chip area, including the pads, is 1.2 × 0.62 mm2 and the supply voltage is 1.8 V.