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Your search keyword '"Da-Sol, Lee"' showing total 3 results
Start Over Author "Da-Sol, Lee" Journal journal of the korean society for precision engineering
3 results on '"Da-Sol, Lee"'

1. Analytical Study of Contact Stress on Wafer Edge in CMP

Author

Seon Ho Jeong, Byeong Jun Park, Haedo Jeong, Hyun-Jin Kim, Da Sol Lee, and Jong Woo Lee

Subjects
Materials science, Mechanical Engineering, 02 engineering and technology, Edge (geometry), 010402 general chemistry, 021001 nanoscience & nanotechnology, 01 natural sciences, Industrial and Manufacturing Engineering, 0104 chemical sciences, Contact mechanics, Wafer, Composite material, 0210 nano-technology, Safety, Risk, Reliability and Quality
Published
2018

2. Effect of Hydrogen Peroxide and Oxalic Acid on Material Removal in Al CMP

Author

Haedo Jeong, Hyunseop Lee, Jin Yeop Jeong, and Da Sol Lee

Subjects
inorganic chemicals, 010302 applied physics, Materials science, Mechanical Engineering, Oxalic acid, Inorganic chemistry, Polishing, 02 engineering and technology, 021001 nanoscience & nanotechnology, Electrochemistry, 01 natural sciences, Chemical reaction, Industrial and Manufacturing Engineering, Corrosion, carbohydrates (lipids), chemistry.chemical_compound, chemistry, Chemical-mechanical planarization, 0103 physical sciences, Slurry, 0210 nano-technology, Safety, Risk, Reliability and Quality, Hydrogen peroxide
Abstract

Chemical mechanical polishing achieves surface planarity through combined mechanical and chemical means. The role of the chemical reaction is very important in a metal CMP like aluminum. The slurry used in aluminum CMP typically consists of oxidizers, a chelating agent, corrosion inhibitors, and abrasives. This study investigates the effect of oxalic acid as a chelating agent for aluminum CMP with H2O2. To study the chemical effect of the chelating agent, the two methods of a polishing experiment and an electrochemical analysis were used. Lastly, it was confirmed that the optimum concentration of oxalic acid significantly improved the removal rate and surface roughness of aluminum.

Published
2017

3. Effect of Slurry Flow in Spray Slurry Nozzle System on Cu CMP

Author

Jin Yeop Jeong, Seon Ho Jeong, Jong Woo Lee, Haedo Jeong, and Da Sol Lee

Subjects
0209 industrial biotechnology, Materials science, Mechanical Engineering, Metallurgy, Nozzle, 02 engineering and technology, 021001 nanoscience & nanotechnology, Industrial and Manufacturing Engineering, Spray nozzle, 020901 industrial engineering & automation, Slurry, 0210 nano-technology, Safety, Risk, Reliability and Quality, Slurry flow
Published
2017

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