1. Synchrotron x-ray diffraction and transmission electron microscopy studies of interfacial reaction paths and kinetics during annealing of fully-002-textured Al/TiN bilayers
- Author
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Lars Hultman, Ivan Petrov, Jra Carlsson, J.-S. Chun, C. Cabral, Patrick Desjardins, Christian Lavoie, Joseph E Greene, and Daniel B. Bergstrom
- Subjects
Materials science ,Annealing (metallurgy) ,Bilayer ,Analytical chemistry ,chemistry.chemical_element ,Surfaces and Interfaces ,Sputter deposition ,Condensed Matter Physics ,Microstructure ,Surfaces, Coatings and Films ,Crystallography ,chemistry ,Transmission electron microscopy ,X-ray crystallography ,Crystallite ,Tin - Abstract
Dense fully-002-textured polycrystalline TiN layers, 110 nm thick with a N/Ti ratio of 1.02±0.03, were grown on SiO2 by ultrahigh vacuum magnetically unbalanced magnetron sputter deposition at Ts=450 °C in pure N2 utilizing high N2+/Ti flux ratios and low energy (EN2+=20 eV) ion irradiation of the growing film. Al overlayers, 160 nm thick and possessing a strong 002 texture inherited from the underlying TiN, were then deposited at Ts=100 °C without breaking vacuum. Synchrotron x-ray diffraction was used to follow interfacial reaction paths and kinetics during postdeposition annealing as a function of time (ta=200–1200 s) and temperature (Ta=500–580 °C). Changes in bilayer microstructure and microchemistry were investigated using transmission electron microscopy (TEM) and scanning TEM to obtain compositional maps of cross-sectional and plan-view specimens by energy dispersive x-ray analysis. The initial bilayer reaction step during annealing involves the formation of a continuous AlN interfacial layer whic...
- Published
- 2001
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