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In this research, the W-40wt.%Cu composite tape-casting films were prepared through the vacuum hot-press sintering method, and the effect of sintering temperature on the microstructures and properties of the W-40wt.%Cu composite samples was studied. Microstructures of the W-40wt.%Cu tape-casting film and the prepared samples were analyzed by field emission scanning electron microscopy (FE-SEM). The phase of the samples was investigated by X-ray diffraction (XRD). The relative density, Vickers hardness, bending strength and electrical conductivity of the samples were investigated. The results show that the relative density of the W-40wt.%Cu composite materials enhances with the increasing of the sintering temperature, at the same time the mechanical and electrical properties are better with the increasing of the sintering temperature. The W-40wt.%Cu composites prepared at the condition of 900°C-200MPa-2h have the relative density of 97%, the bending strength of 507.3MPa, the Vickers hardness of 376.2HV and the electrical conductivity of 32.5% IACS, respectively.

Diffusion bonded joints of Ti alloys and Al alloys are widely applied in chemical, nuclear, aerospace industries. In the present study, TC4/Al thin film/1060 Al joints were bonded successfully by means of diffusion bonding under low temperature. The microstructure and mechanical properties of the joints were investigated by SEM,XRD and shear strength test. The results showed that the highest shear strength of TC4/Al thin film/1060 Al joints was 80.2 MPa. With the increasing of temperature, the shear strength increases firstly and then almost remains the same. Ti and Al elements diffused to each other in the bonding process and the intermetallic compounds can’t be found. The fracture of the joint had taken place in the 1060 Al/Al thin film rather than in the TC4/Al thin film and the fracture way of the joints was ductile fracture.

In this work, monodispersed silver nanoparticles with controllable size have been successfully in situ synthesized in PMMA matrix. NaHS, HCl and poly (vinyl pyrrolidone) (PVP) were used to optimize the nucleation and growth of silver nanocrystalline. UV–vis analysis and transmission electron microscopy (TEM) were used to characterize the size and dispersion of silver nanoparticles in the Ag/PMMA nanocomposites. The results show that silver nanoparticles homogeneously distribute in PMMA/DMF sol and the particle size of silver nanoparticles increase with the increasing of time. The nucleation of Ag atoms can be facilitated through the addition of a trace amount of NaHS to generate Ag2S clusters as heterogeneous nuclei. Introducing a trace amount of Cl- into the reaction system can effectively reduce the growth rate of the nanoparticles and thus generating more uniform silver nanoparticles in PMMA matrix.

A new ternary composite of W-SiCP/Cu(40vol%) was designed and prepared by low-temperature hot-press sintering. The micro-structural characterizations were evaluated by X-ray diffraction (XRD) and scanning electron microstructure (SEM), coefficient of thermal expansion is measured. When sintered at 950°C-100MPa-2h, the relative density of the W-SiCP/Cu composites as a function of W content all exceeded 97%. Due to the plastic deformation of Cu, higher densification W-SiCP/Cu(40vol%) composites can be achieved at a relatively low temperature. The composites are characterized by the relatively low coefficient of thermal expansion, bending strength and hardness. The values of thermal expansion indicate that thermal expansion can be precisely controlled by adding SiC particles.

Aluminum (Al) and Copper (Cu) have been used in graded density impactors. Al-Cu composites with different compositions have been prepared by hot pressing sintering. Intermetallic compounds were produced when the temperature was above 723 K, while they can’t be found at the temperature of 723 K. The relative density of Al-Cu composites from pure Al to pure Cu consolidated at 723K all exceeded 98.5%. The optimum sintering conditions were then determined to sintering temperature of 723 K, uniaxial pressure of 100 MPa, and duration time of 2 h. Al and Cu were mixed homogeneously and well compacted, and no obvious pores were found. The thickness of diffusion layer between Al and Cu was very thin, only about 0.6 μm. The wave impedance values increased almost linearly from 16.98×106to 40.66×106kg/m2·s with increasing Cu content in Al-Cu composite from 0 to 100 vol.%, which was well consistence with the values calculated according to the rule of mixtures. The elastic modulus of different compositions matched well with the theoretical model of Voigt and Reuss. Highly densified Al-Cu composites without intermetallic compounds were successfully prepared using hot-pressure sintering, which was the basis of fabricating Al-Cu system graded density impactors.

Carbon nanofillers/polymer nanocomposites foam with electrical conductivity was a novel functional material. In this study, the CNTs/PMMA nanocomposites were prepared by the combination of ultrasonic dispersion and anti-solvent precipitation method. Then supercritical foaming method was untilized applied to prepare the foams. The morphology and the electrical conductivity of the foams were investigated. The conductivity of the nanocomposites showed a conductor behavior which was increased t from 1×10-6S/cm to 1×10-5S/cm with the CNTs content range from 1 wt.% to 2.5 wt.%. After foaming, the cell size of the foams was below 10 μm while the cell density increased 2~3 orders of magnitude compared with PMMA foams. The produced CNTs/PMMA nanocomposites foams exhibited a wide range electricity conductivity of the nanofiller contents. Key words: structure, electrical conductivity, CNTs, nanocomposites foams

A micro piezoelectric cantilever beam array is designed for vibration energy harvesting. A single degree of freedom analytical model is developed to predict the properties of the device and is verified by finite element method. The piezoelectric material Aluminum Nitride was chosen for the compatibility with the CMOS process. The devices consisting of 5 piezoelectric cantilever beams and one proof mass were fabricated using micromachining technology. The resonance frequency, voltage and power were tested at excitation acceleration of 5.0 g. The maximum output power of the device is 9.13 μW at the resonance frequency of 1315 Hz when piezoelectric beams are connected in parallel.

Mo and Cu Were Bonded Successfully by Means of Vacuum Diffusion Bonding. The Interfacial Structure of the Joints Was Studied by Scanning Electron Microscopy (SEM), Electron Probe Microanalysis (EPMA), Energy Dispersive X-Ray Spectrometer (EDS) and X-Ray Diffraction (XRD), the Mechanical Property Is Tested by Tensile Strength Measurement. The Results Showed that the Differentatoms Diffused to each other in the Bonding Process. A Mo-Cu Solid Solution Was Formed in the Joint and with No Intermetallic Compounds. The Tensile Strength of the Joint Increased with the Increasing of Temperature, however, while the Holding Time Increased, the Strength Increased in the First Stages and then Decreases. It Were Observed that the Fracture Mode of the Joints Was a Brittle Fracture.

Tape casting was used for the preparation of Mg-Cu systems density graded materials. A series of tapes with uniform compositions ranging from 100wt% Cu to 100wt% Mg were fabricated with sufficient strength to be handled during the post-processing stage. The effect of the tape casting process parameters on the properties of the tape were studied, such as the composition of the Mg-Cu and the solid loading. The rheology of the slurry of different Mg-Cu composition for tape casting was characterized by viscosity. The tapes characterized by microstructure, thickness and bulk density were outlined. The results demonstrated that the different Mg-Cu composition slurry with well-dispersed, high stability, certain solid loading from 45 ~70 wt% were obtained. The viscosity of the slurry and the density of the green tapes were increased with the increasing of the content of Mg. The thickness of tapes of compositions ranging from 100wt% Cu to 100wt% Mg with certain strength could be achieved 68-110μm and the density of the tapes was 0.74-2.42g/cm3. For 100wt% Cu tapes, when the solid loading was 68wt%, the high density tape was produced. The tapes with different thickness, density and different Mg-Cu compositions were obtained.

Micro abrasive jet machining (MAJM) is a high effective economical technology for three dimensional micro structure fabrications of brittle materials. It is widely used in the fabrication of semiconductors, electronic devices, micro electro-mechanical systems (MEMS), optical-electronic and optical devices, and medical instruments. In this paper, based on the experimental study of MAJM for glass, the influences of the nozzle type/size and abrasive type on the material erosion rate and structure profile are analyzed. The results show that the rectangular nozzle can yield a more accurate and efficient machining performance due to reduced flux effect. By contrast, with round nozzle all the cross section profiles of the machined patterns show rounded V-type shape. The rectangular nozzle is able to produce geometry with flat shape. The machining area is almost independent of the abrasive hardness, and the erosion rate increases with the increase in the hardness of the abrasive grits. The nozzle geometry is of great importance for machining accuracy and the efficiency.

Dense SnO2 based ceramics are widely used. In this paper, 95SnO2-5MnO2 ceramics were prepared by pressureless sintering in air at different temperatures. Phase compositions and microstructures are examined by XRD, SEM and EDX, respectively. The SEM results show that different morphologies exist at the SnO2 grain boundary of ceramic, which compose of manganese oxidation, testified by EDX. The different manganese oxides phases, found by XRD, are the source of oxygen concentration at the grain boundary during heating and oxygen dissipation when cooling. However, solid solutions of Mn, Sn and O are not observed. The density of 95SnO2-5MnO2 ceramics decreases with increasing the sintering temperature, due to the evaporation of SnO and decreasing concentration of oxygen at grain boundary in the cooling process. Densification of the ceramic is promoted with inhibiting the decomposition of SnO2 by increasing oxygen concentration in the heating process, but it is limited by the dissipation of oxygen at the grain boundary in the cooling process.

In this study, SnO2-based ceramics, with 0.5%CuO as sintering aid and Sb2O3 as activator of the electrical conductivity, was obtained by pressureless sintering at 1450°C for 5 h. Densification behavior and microstructure development strongly depend on Sb2O3. The characteristization of microstructures on Sb2O3 concentrations are analyzed by SEM. A small amount of CuO improves densification; Sb2O3 retards the densification of SnO2-based ceramic. The electrical resistivities of SnO2-based ceramics with different contents of Sb2O3 are measured by the standard four probe method and varied in a wide range. The electrical resistivity arrives the minimal value of 4.964×10-2 0·cm for 99%SnO2+0.5%CuO +0.5%Sb2O3. More content of Sb2O3 than that of CuO causes the degression of density and the increasing of electrical resistivity of ceramics.

A new kind of functionally graded materials (FGM) with density gradient has come to show great potentials as flier-plates for creating quasi-isotropic compression waves. In order to meet the demand of lower density in the front face and wider density range for such flier-plate, Mg with a density of 1.74g/cm3 and W of 19.3g/cm3 are selected to make Mg-W system density graded materials. Mg-W alloys with various mass fractions of Mg and W were sintered by spark plasma sintering (SPS) technique at low temperatures, and the processing of densification is mainly investigated. It is found that, up to 92wt%W, the Mg-W alloys can be fully densified at 873K due to the conglutination of Mg particles. The Mg-W alloys still exist as a mechanical mixture of Mg and W. Finally, the Mg-W density graded materials with a density change from 1.74g/cm3 to 10.55g/cm3 have been successfully prepared.