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The growth of metal-organic frameworks (MOFs) on a metal ion-doped polymer as a precursor and support substrate was investigated based on mechanistic and kinetic analyses. The studies were performed by varying the reaction temperature and the concentrations of the organic ligand and nucleation-promoted additive. Using the NH

A three-dimensional metal–organic framework (MOF) consisting of pillared square-grid nets based on paddle-wheel units was synthesized by interfacial self-assembly of the frameworks on a metal-ion-doped polymer substrate. Although this type of Cu-based MOF is typically synthesized by a two-step solvothermal method, the utilization of a metal-ion-doped polymer substrate as a metal source for the framework allowed for the one-pot growth of MOF crystals on the substrate. The morphology of the obtained MOF crystals could be controlled from tetragonal to elongated tetragonal with different aspect ratios by changing the concentrations of the dicarboxylate layer ligands and diamine pillar ligands. The present approach provides a new route for the design and synthesis of MOF crystals and thin films for future applications such as gas membranes, catalysts, and electronic devices.

We report a fully additive-based electrochemical approach to the site-selective deposition of silver on a polyimide substrate. Using a cathode coated with ion-doped precursor polyimide layers, patterns of metal masks used as anodes were successfully reproduced at the cathode-precursor interface through electrochemical and ion-exchange reactions, which resulted in the generation of silver patterns on the polyimide films after subsequent annealing and removal from the substrate. Excellent interfacial adhesion was achieved through metal nanostructures consisting of interconnecting silver nanoparticles at the metal-polymer interface, which are electrochemically grown "in" the precursor layer. This approach is a resist- and etch-free process and thus provides an effective methodology toward lower-cost and high-throughput microfabrication.

Facile imprint and wet chemical processes were used to fabricate copper damascene patterns on polyimide substrate. Poly(amic acid) substrate with trench structures as template has been successfully prepared by imprint lithography using a poly(dimethylsiloxane) mold. The doped Ni(2+) ions into a template through ion-exchange reaction were reduced by an aqueous NaBH(4) solution, resulting in the formation of a nickel thin layer along the surface structure of the template. The resulting nickel films can act as catalyst for subsequent electrodeposition of copper. After electrodeposition, a polishing process was carried out for removing excess deposited copper films, followed by imidization of the substrate. The resulting damascene structured copper films exhibited fine and good adhesion with the polyimide substrate, and they could be utilized for good application in the fields of minute copper circuit patterns on insulating substrates.

Polypyrrole-palladium (PPy-Pd) nanocomposite was deposited in situ from aqueous solution onto micrometer-sized polystyrene (PS) latex particles. The PS seed particles and resulting composite particles were extensively characterized with respect to particle size and size distribution, morphology, surface/bulk chemical compositions, and conductivity. PPy-Pd nanocomposite loading onto the PS seed latex particles was systematically controlled over a wide range (10-60 wt %) by changing the weight ratio of the PS latex and PPy-Pd nanocomposite. Pd loading was also controlled between 6 and 33 wt %. The conductivity of pressed pellets increased with the PPy-Pd nanocomposite loading and four-point probe measurements indicated conductivities ranging from 3.0 x 10(-1) to 7.9 x 10(-6) S cm(-1). Hollow capsule and broken egg-shell morphologies were observed by scanning/transmission electron microscopy after extraction of the PS component from the composite particles, which confirmed a PS core and PPy-Pd nanocomposite shell morphology. X-ray diffraction confirmed that the production of elemental Pd and X-ray photoelectron spectroscopy indicated the existence of elemental Pd on the surface of the composite particles. Transmission electron microscopy confirmed that nanometer-sized Pd particles were distributed in the shell. The nanocomposite particles functioned as an efficient catalyst for Suzuki-type coupling reactions in aqueous media for the formation of carbon-carbon bonds.

Metallization methods of polyimide by hyperthermal atomic oxygen and atomic fluorine beams were developed. An atomic fluorine beam with a translational energy of 6.2 eV modified the wettability of polyimide surfaces to provide an advancing water contact angle of 132 degrees. It was confirmed that in-air storage for 2 months did not alter the hydrophobic property created by the atomic fluorine beam. This stable beam-induced surface fluorination technique was then applied to site-selective electroless Cu plating on polyimide. It was demonstrated that changing the exposure sequence could create both positive- and negative-type plating processes.