1. Laminate Design of Carbon-Fiber-Reinforced Resin Matrix Composites for Optimized Mechanical Properties and Electrical Conductivity
- Author
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Hongxue Tan, Yanxiang Wang, Chengguo Wang, Chengjuan Wang, Mengfan Li, Haotian Jiang, and Zhenhao Xu
- Subjects
composite material ,pantograph slide plate ,carbon fiber ,laminated structure ,Technology ,Electrical engineering. Electronics. Nuclear engineering ,TK1-9971 ,Engineering (General). Civil engineering (General) ,TA1-2040 ,Microscopy ,QH201-278.5 ,Descriptive and experimental mechanics ,QC120-168.85 - Abstract
Carbon fiber composites as pantograph slide materials are in the development stage, in which copper is the conductive phase, and the addition form and size need to be designed. Herein, the effects of the copper morphology, the size of the copper mesh on the performance, and the influence of the contact mode between the sliding plate and bracket on the temperature rise were compared and analyzed. The resistivity is 11.2 μΩ·m with the addition of 20 wt% copper mesh, a relative reduction of 91.77%. Importantly, the impact strength is increased by 14.19%, and the wear is reduced by 13.21%; hence, the copper mesh laid in layers is the ideal structure. Further study of the distribution and quality of the copper mesh shows that the resistivity is related only to the quality of the copper mesh; in addition, the number of layers of the copper mesh cannot exceed 16, and it is determined that the best type of copper mesh is 5#. Notably, the performance can be improved by appropriately reducing the thickness of the copper mesh and increasing the aperture while the sliding plate and the bracket are connected by copper mesh with conductive adhesive, which has the slowest heating rate of 2.27 °C/min and the smallest resistance. Therefore, the influence of copper content and distribution on the electrical conductivity are systematically investigated, and the mechanical properties and electrical conductivity are optimized through the design of the laminate structure of the compound material.
- Published
- 2022
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