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[Display omitted] • The Ni-Co base dual-phase superalloy is welded successfully at a broad range of temperatures by hot-compression bonding. • The interfacial healing mechanism of superalloys at different temperatures involves two main recrystallization mechanisms. • The deformation mechanism of primary γ′ phase changes with increasing deformation temperature. • Heterogeneous epitaxial recrystallization is induced by diffusion of Cr elements and DDRX is induced by strain gradients. Hot-compression bonding (HCB) as an advanced technique for preparation of large-size homogenized components is widely applied. Despite the fact that interfacial healing mechanisms during HCB have been extensively investigated, the interfacial healing mechanisms in duplex superalloys still need to be clarified. This article investigates effect of deformation temperature on multiple interface (γ′-γ′, γ-γ, γ-γ′) healing mechanism of dual-phase superalloys. The healing mechanism of γ-γ interface at different temperatures involves a necklace-like distribution of discontinuous dynamic recrystallization (DDRX) grains occupying original interface. With increasing deformation temperature, the healing mechanism of γ′-γ′ interface transforms from DDRX to diffusion bonding due to weakening of strain concentration. Simultaneously, as deformation temperature increases, the deformation mechanism of primary γ′ phase transforms from shearing by stacking fault to dislocation pairs. At deformation temperature 1100 °C, the healing mechanism of γ′-γ interface is heterogeneous epitaxial recrystallization (HERX) induced by primary γ′ phase driven by diffusion of Cr element in dislocation pairs. However, as deformation temperature decreases, healing mechanism in γ′-γ interface transforms into DDRX. Although interfacial healing mechanism is transformed at different deformation temperatures, the synergistic action of different recrystallization mechanisms ensures that mechanical properties of joints reached the same level as those of base material. [ABSTRACT FROM AUTHOR]