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The excellent electrical properties of graphene have received widespread attention. However, the difficulty of electron transfer between layers still restricts the application of graphene composite materials to a large extent. Therefore, in this study, graphene/polyimide films were subjected to a Joule heating treatment to improve the electrical conductivity of the film by ~76.85%. After multiple Joule thermal cycle treatments, the conductivity of the graphene/polyimide film still gradually increased, but the increase in amplitude tended to slow down. Finally, after eight Joule heat treatments, the conductivity of the graphene/polyimide film was improved by ~93.94%. The Joule heating treatment caused the polyimide to undergo atomic rearrangement near the interface bonded to the graphene, forming a new crystalline phase favourable for electron transport with graphene as a template. Accordingly, a model of the bilayer capacitive microstructure of graphene/polyimide was proposed. The experiment suggests that the Joule heating treatment can effectively reduce the distance between graphene electrode plates in the bilayer capacitive micro-nanostructures of graphene/polyimide and greatly increases the number of charge carriers on the electrode plates. The TEM and WAXS characterisation results imply atomic structure changes at the graphene/polyimide bonding interface. [ABSTRACT FROM AUTHOR]

Polyimide (PI) films are widely used in electronic devices owing to their excellent mechanical and electrical properties and high thermal and chemical stabilities. In particular, PI films play an important role in flexible printed circuit boards (FPCBs). However, one challenge currently faced with their use is that the adhesives used in FPCBs cause a high dielectric loss in high-frequency applications. Therefore, it is envisioned that PI films with a low dielectric loss and Cu films can be used to prepare two-layer flexible copper-clad laminates (FCCLs) without any adhesive. However, the preparation of ultra-thin FCCLs with no adhesives is difficult owing to the low peel strength between PI films and Cu films. To address this technical challenge, an FCCL with no adhesive was prepared via high-power helicon wave plasma (HWP) treatment. Field-emission scanning electron microscopy (FE-SEM), X-ray photoelectron spectroscopy (XPS), and X-ray diffraction (XRD) were tested. Also, the surface roughness of the PI film and the peel strength between the PI film and Cu film were measured. The experimental results show that the surface roughness of the PI film increased by 40–65% and the PI film demonstrated improved adhesion (the peel strength was >8.0 N/cm) with the Cu film following plasma treatment and Cu plating. [ABSTRACT FROM AUTHOR]

Thermoelectric materials in the form of thin films are used to create a wide variety of sensors and devices. The efficiency of these devices depends on the quality and efficiency of the thermoelectric materials obtained in the form of thin films. Earlier, we demonstrated that it is possible to obtain high-performance Bi2Te3Sb1.5 films less than 1 μm thick on polyimide substrates by using the PLD method, and determined optimal growth conditions. In the current work, the relationship between growth conditions and droplet fraction on the surface, microstructure, grain size, film thickness and chemical composition was studied. A power factor of 5.25 μW/cm×K2 was achieved with the reduction of droplet fraction on the film surface to 0.57%. The dependencies of the film thickness were studied, and the effect of the thickness on the efficiency of the material is shown. The general trend in the growth dynamics for Bi2Te3Sb1.5 films we obtained is the reduction of crystalline size with Pressure-Temperature (PT) criterion. The results of our work also show the possibility of a significant reduction of droplet phase with simultaneous management of crystalline features and thermoelectric efficiency of Bi2Te3Sb1.5 films grown on polyimide substrates by varying growth conditions. [ABSTRACT FROM AUTHOR]

Polycrystalline PbTe:In films on a polyimide substrate were obtained and investigated. Their structural and transport properties in a wide range of temperatures (10–300 K) were studied. The unique feature of In impurity in PbTe is the stabilization of the Fermi level (pinning effect) that allowed for the preparation polycrystalline films with the same carrier concentration. We found that heat treatment in an argon atmosphere does not change the average grain size and carrier concentration for as-grown films but greatly increases the Hall mobility and the electron mean free path. By comparing the mobility in the bulk and in the film after heat treatment, we extracted the value of the mobility that arises due to scattering at the grain boundary barriers. The ultimate goal of the present study is the development of these films in designing portable uncooled photodetectors for the mid-IR range. [ABSTRACT FROM AUTHOR]

With the development of flexible electronic technology, lately, there has been an increase in demand for flexible electronic devices based on soft polymer-substrate metal film structures in challenging applications. These soft polymer-substrate metal film structures must tolerate bending, folding, stretching, and even deformation into any shape without failing to be used successfully. As a result, research into the fracture behavior of soft polymer-substrate metal film structures is essential. The purpose of this study was to investigate how fractures develop in Cr film attached to a polyimide (PI) substrate under biaxial stress. A fracture development model was built to determine the fracture propagation law of soft polymer-substrate metal film structures under biaxial stress. Experiments and finite element methods were applied to verify the correctness of the model. The theoretical analysis and finite element simulation results showed that fractures appeared initially at the perimeter of the film and then propagated to the center under biaxial stress. The theoretical and experimental results indicated that the crack propagation direction was related to the ratio of biaxial loading, which became progressively parallel to the direction of small loading as the biaxial loading ratio increased. The theoretical results were in line with the experiment results, which could be used as a preliminary step for further research on the fracture behavior of film-substrate structures. [ABSTRACT FROM AUTHOR]

Wholly aromatic polyimide (PI) films with good solution processability, light colors, good optical transparency, high storage modulus, and improved heat resistance were prepared and characterized. For this purpose, a multi-component copolymerization methodology was performed from a fluoro-containing dianhydride, 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA), a rigid dianhydride, 3,3′,4,4′-biphenyltetracarboxylic dianhydride (BPDA), and a fluoro-containing diamine, 2,2′-bis(trifluoromethyl)-4,4′-bis [4-(4-amino-3-methyl)benzamide]biphenyl (MABTFMB). One homopolymer, FPI-1 (6FDA-MABTFMB), and five copolymers, FPI-2~FPI-6, containing the BPDA units from 10 mol% to 50 mol% in the dianhydride moieties, were prepared, respectively. The derived PI resins showed good solubility in the polar aprotic solvents, such as N-methyl-2-pyrrolidone (NMP) and N,N-dimethylacetamide (DMAc). The flexible PI films obtained by the solution casting procedure showed good optical properties with the transmittances higher than 74.0% at the wavelength of 450 nm. The PI films exhibited excellent thermal properties, including 5% weight loss temperatures (T5%) over 510 °C, together with glass transition temperatures (Tg) over 350.0 °C according to the peak temperatures of the loss modulus in dynamical mechanical analysis (DMA) measurements. The FPI-6 film also showed the lowest linear coefficient of thermal expansion (CTE) value of 23.4 × 10−6/K from 50 to 250 °C according to the thermomechanical analysis (TMA) measurements, which was obviously lower than that of FPI-1 (CTE = 30.6 × 10−6/K). [ABSTRACT FROM AUTHOR]

Three titanium (Ti) targets with different purities were used to prepare Ti films on polyimide substrates by DC magnetron sputtering. The microstructures of Ti films were characterized by a metallographic microscope, X-ray diffractometer, field emission scanning electron microscope and three-dimensional surface topography instrument. In this study, we investigated the effects of Ti target purity and microstructure on film deposition rate, surface roughness, microstructure and resistivity. The results show that the deposition rate increased with increasing Ti target purity. Ti film deposited by the high-purity (99.999%) Ti target has fewer surface particles with smaller size, lower surface roughness and lower resistivity when compared to that prepared by the Ti target of low purity (99.7%). The surface roughness of Ti film prepared by the high-purity Ti target was Sa = 121 nm, the deposition rate was 16.3 nm/min and the resistivity was 6.9 × 10−6 Ω·m. For Ti targets of the same purity, the performance of Ti film prepared by a target with equiaxed α-phase grains is better than that of Ti film prepared by a target with twins and β-phase grains. [ABSTRACT FROM AUTHOR]

Polymer adhesives have emerged as a promising dielectric passivation layer in hybrid bonding for 3D integration, but they raise misalignment problems during curing. In this work, the synergistic effect of oxygen plasma surface activation and wetting is utilized to achieve bonding between completed cured polyimides. The optimized process achieves a void-less bonding with a maximum shear strength of 35.3 MPa at a low temperature of 250 °C in merely 2 min, significantly shortening the bonding period and decreasing thermal stress. It is found that the plasma activation generates hydrophilic groups on the polyimide surface, and the wetting process further introduces more −OH groups and water molecules on the activated polyimide surface. The synergistic process of plasma activation and wetting facilitates the bridging of polyimide interfaces to achieve bonding, providing an alternative path for adhesive bonding in 3D integration. [ABSTRACT FROM AUTHOR]

Three-component organic/inorganic hybrid films were fabricated by drop-casting the mixed dispersion of nanodispersed-poly(nickel 1,1,2,2-ethenetetrathiolate) (nano-PETT), polyimide (PI) and super growth carbon nanotubes (SG-CNTs) in N-methylpyrrolidone (NMP) at the designed ratio on a substrate. The dried nano-PETT/PI/SG-CNT hybrid films were prepared by the stepwise cleaning of NMP and methanol, and were dried once more. The thermoelectric properties of Seebeck coefficient S and electrical conductivity σ were measured by a thin-film thermoelectric measurement system ADVANCE RIKO ZEM-3M8 at 330-380 K. The electrical conductivity of nano-PETT/PI/SG-CNT hybrid films increased by 1.9 times for solvent treatment by clearing insulated of polymer. In addition, the density of nano-PETT/PI/SG-CNT hybrid films decreased 1.31 to 0.85 g·cm-3 with a decrease in thermal conductivity from 0.18 to 0.12 W·m-1·K-1. To evaluate the thermostability of nano-PETT/PI/SG-CNT hybrid films, the samples were kept at high temperature and the temporal change of thermoelectric properties was measured. The nano-PETT/PI/SG-CNT hybrid films were rather stable at 353 K and kept their power factor even after 4 weeks. [ABSTRACT FROM AUTHOR]

We demonstrate an erbium-doped fiber laser passively Q-switched by a black-phosphorus polyimide film. The multi-layer black-phosphorus (BP) nanosheets were prepared via a liquid exfoliation approach exploiting N-methylpyrrolidone as the dispersion liquid. By mixing the BP nanosheets with polyimide (PI), a piece of BP-PI film was obtained after evaporating the mixture in a petri dish. The BP-PI saturable absorber had a modulation depth of 0.47% and was inserted into an erbium-doped fiber laser to realize passive Q-switched operations. The repetition rate of the Q-switched laser increased from 5.73 kHz to 31.07 kHz when the laser pump was enhanced from 31.78 mW to 231.46 mW. Our results show that PI is an excellent host material to protect BP from oxidation, and the BP-PI film can act as a promising nonlinear optical device for laser applications. [ABSTRACT FROM AUTHOR]

A series of new organic polyimides were synthesized from 4-fluoro-4'4"-diaminotriphenylmethane and four different aromatic dianhydrides through a one-step, high-temperature, direct polycondensation in m-cresol at 180-200 °C, resulting in the formation of high-molecular-weight polyimides (inherent viscosities ∼ 1.0-1.3 dL/g). All the resulting polyimides exhibited good thermal stability with initial decomposition temperatures above 434 °C, glass-transition temperatures between 285 and 316 °C, and good solubility in polar aprotic solvents. Wide-angle X-ray scattering data indicated that the polyimides were amorphous. Dense membranes were prepared by solution casting and solvent evaporation to evaluate their gas transport properties (permeability, diffusivity, and solubility coefficients) toward pure hydrogen, helium, oxygen, nitrogen, methane, and carbon dioxide gases. In general, the gas permeability was increased as both the fractional free volume and d-spacing were also increased. A good combination of permeability and selectivity was promoted efficiently by the bulky hexafluoroisopropylidene and 4-fluoro-phenyl groups introduced into the polyimides. The results indicate that the gas transport properties of these films depend on both the structure of the anhydride moiety, which controls the intrinsic intramolecular rigidity, and the 4-fluoro-phenyl pendant group, which disrupts the intermolecular packing. [ABSTRACT FROM AUTHOR]

A wearable electronic system constructed with multiple sensors with different functions to obtain multidimensional information is essential for making accurate assessments of a person's condition, which is especially beneficial for applications in the areas of health monitoring, clinical diagnosis, and therapy. In this work, using polyimide films as substrates and Pt as the constituent material of serpentine structures, flexible temperature and angle sensors were designed that can be attached to the surface of an object or the human body for monitoring purposes. In these sensors, changes in temperature and bending angle are converted into variations in resistance through thermal resistance and strain effects with a sensitivity of 0.00204/°C for temperatures in the range of 25 to 100 °C and a sensitivity of 0.00015/° for bending angles in the range of 0° to 150°. With an appropriate layout design, two sensors were integrated to measure temperature and bending angles simultaneously in order to obtain decoupled, compensated, and more accurate information of temperature and angle. Finally, the system was tested by being attached to the surface of a knee joint, demonstrating its application potential in disease diagnosis, such as in arthritis assessment. [ABSTRACT FROM AUTHOR]

This study designed and synthesised a meta-amide-substituted dianiline monomer (m-DABA) as a stereoisomer of DABA, a previously investigated para-amide-substituted dianiline monomer. This new monomer was polymerised with pyromellitic dianhydride (PMDA) to prepare a polyimide film (m-DABPI) in a process similar to that employed in a previous study. The relationship between the substitution positions on the monomer and the gas barrier properties of the polyimide film was investigated via molecular simulation, wide-angle X-ray diffraction (WXRD), and positron annihilation lifetime spectroscopy (PALS) to gain deeper insights into the gas barrier mechanism. The results showed that compared with the para-substituted DABPI, the m-DABPI exhibited better gas barrier properties, with a water vapour transmission rate (WVTR) and an oxygen transmission rate (OTR) as low as 2.8 g·m−2·d−1 and 3.3 cm3·m−2·d−1, respectively. This was because the meta-linked polyimide molecular chains were more tightly packed, leading to a smaller free volume and lower molecular chain mobility. These properties are not conducive to the permeation of small molecules into the film; thus, the gas barrier properties were improved. The findings have significant implications for the structural design of high-barrier materials and could promote the development of flexible display technology. [ABSTRACT FROM AUTHOR]

Polyimides (PIs) represent a benchmark for high-performance polymers on the basis of a remarkable collection of valuable traits and accessible production pathways and therefore have incited serious attention from the ever-demanding medical field. Their characteristics make them suitable for service in hostile environments and purification or sterilization by robust methods, as requested by most biomedical applications. Even if PIs are generally regarded as "biocompatible", proper analysis and understanding of their biocompatibility and safe use in biological systems deeply needed. This mini-review is designed to encompass some of the most robust available research on the biocompatibility of various commercial or noncommercial PIs and to comprehend their potential in the biomedical area. Therefore, it considers (i) the newest concepts in the field, (ii) the chemical, (iii) physical, or (iv) manufacturing elements of PIs that could affect the subsequent biocompatibility, and, last but not least, (v) in vitro and in vivo biocompatibility assessment and (vi) reachable clinical trials involving defined polyimide structures. The main conclusion is that various PIs have the capacity to accommodate in vivo conditions in which they are able to function for a long time and can be judiciously certified as biocompatible. [ABSTRACT FROM AUTHOR]

The spontaneous vertical alignment of liquid crystals (LCs) in gelator (12-hydroxystearic acid)-doped LC cells was studied. Gelator-induced alignment can be used in both positive and negative LC cells. The electro-optical characteristics of the gelator-doped negative LC cell were similar to those of an LC cell that contained a vertically aligned (VA) host. The rise time of the gelator-doped LC cell was two orders of magnitude shorter than that of the VA host LC cell. The experimental results indicate that the gelator-induced vertical alignment of LC molecules occurred not only on the surface of the indium tin oxide (ITO) but also on the homogeneous alignment layer. Various LC alignments (planar, hybrid, multistable hybrid, and vertical alignments) were achieved by modulating the doped gelator concentrations. The multistable characteristic of LCs doped with the gelator is also presented. The alignment by doping with a gelator reduces the manufacturing costs and provides a means of fabricating fast-responding, flexible LC displays using a low-temperature process. [ABSTRACT FROM AUTHOR]