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As a traditional interconnect material, silver alloy bonding wires are widely used in electronic packaging, but their propensity to vulcanize quickly has not been sufficiently addressed. The current surface anti-oxidation and anti-sulfidation treatments are often accompanied by a decline in bonding performance, which hinders the use of silver alloy bonding wires in new applications. In the present paper, we develop a new cathodic passivation treatment in a Pd-containing solution for silver bonding wires, which not only significantly improves their vulcanization resistance, but also maintains their bonding performance. The surface of the treated wires remains unaffected after vulcanization in 0.3 μg/m3 of ammonium sulfide for 60 min. Compared to a Pd-free passivation treatment, the bonding strength of the wire passivated with the Pd-containing solution improves from 0.20 to 0.27 N. XPS analysis confirms the existence of Pd on the surface of the wire. The solder ball formed an obtuse angle instead of a sharp angle on the pad, which is beneficial for bonding strength. [ABSTRACT FROM AUTHOR]

Lightweight high-entropy alloys (HEAs) are a new class of low-density, high strength-to-weight ratio metallic structural material. Understanding their corrosion behavior is crucial for designing microstructures for their practical applications. This work investigates the electrochemical corrosion behavior of lightweight HEAs AlCrTiV0.5Cux (x = 0, 0.2, 0.4, 0.6, 0.8, and 1.0) in a 0.6 M NaCl solution. These HEAs were produced by vacuum arc melting. In contrast to 304L stainless steel, all of the alloys exhibited lower current density levels caused by self-corrosion, with AlCrTiV0.5 demonstrating the highest corrosion resistance (0.131 μA/cm2). Corrosion resistance decreased along with the content of copper because copper segregation accelerated local corrosion throughout the alloy. [ABSTRACT FROM AUTHOR]