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Abstract: Porous sialon ceramics have been cost-effectively prepared by pressureless sintering from a mixture of elongated SHS β-sialon powders with an α-sialon precursor composition composed of α-Si3N4, AlN, Y2O3 and Al2O3. The obtained porous sialon ceramics exhibited low shrinkage and homogeneous pore size distribution. The results of X-ray diffraction and scanning electron microscopy showed that a uniform microstructure with elongated and intermingled β-SiAlON grains, which were strongly connected by α-SiAlON phase, has been obtained. [Copyright &y& Elsevier]

• B-site precursor method can effectively inhibit the appearance of second phase. • B-site precursor method can obtain high reactivity Mg 4 Nb 2 O 9 powders. • B-site precursor method can promote integrality of the crystal structure. Mg 4 Nb 2 O 9 ceramics have been prepared by B-site precursor method in this work. Experimental results demonstrate that the uniform particles-size distribution of Mg 4 Nb 2 O 9 powders can be obtained, which exhibit high reactivity to promote the grain growth of Mg 4 Nb 2 O 9 ceramics. Moreover, the Mg 4 Nb 2 O 9 ceramics via B-site precursor method can be sintered at a wide range of sintering temperature from 1275 to 1375 °C with single phase Mg 4 Nb 2 O 9 composition and high crystallinity. Compared to the conventional solid-state method, the Mg 4 Nb 2 O 9 ceramics prepared by B-site precursor method exhibit excellent Q × f value by above 168,756 GHz. [ABSTRACT FROM AUTHOR]

Abstract: The oxygen content is usually difficult to control in direct bonding copper process. In this study a new method for preparation of direct bonding copper on alumina ceramic substrates was realized. 96% Al2O3 ceramic substrates were first oxidized by pasting a thin layer of Cu2O and firing at 1150 °C in air. Then copper foil was bonded to the substrate by heating to 1070 °C in pure N2 atmosphere. Microstructure and composition of the interface between the copper and Al2O3 ceramic were analyzed. The XRD and EDS results show that an interphase of CuAlO2 was formed and a eutectic transformation between oxygen and copper took place at the interface of the copper and the ceramic substrate. The interface was much thicker than the traditionally bonded substrates, which resulted in a better bonding strength. The directly bonded copper alumina substrate samples showed no evidence of de-bonding after 50 thermal cycles comprising quenching from 220 °C to room temperature. [Copyright &y& Elsevier]