12 results on '"Liu, Yuling"'
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2. Investigation of the barrier slurry with better defect performance and facilitating post-CMP cleaning
3. Removal rate and surface quality of the GLSI silicon substrate during the CMP process
4. A study on exploring the alkaline copper CMP slurry without inhibitors to achieve high planarization efficiency
5. Stability of weakly alkaline barrier slurry with the high selectivity
6. Effect of chelating agent on benzotriazole removal during post copper chemical mechanical polishing cleaning
7. Chemical mechanical planarization of barrier layers by using a weakly alkaline slurry
8. A study on the comparison of CMP performance between a novel alkaline slurry and a commercial slurry for barrier removal
9. Kinetics model incorporating both the chemical and mechanical effects on material removal for copper chemical mechanical polishing
10. Optimization of slurry components for a copper chemical mechanical polishing at low down pressure using response surface methodology
11. Investigation on the final polishing slurry and technique of silicon substrate in ULSI
12. Study on the cleaning of silicon after CMP in ULSI
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