Author: "Ritzdorf, T." / Journal: microelectronic engineering - Searchworks@Jio Institute Digital Library Search Results

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Start Over Author "Ritzdorf, T." Journal microelectronic engineering

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1. Formation of TSV for the stacking of advanced logic devices utilizing bumpless wafer-on-wafer technology

Author: Diehl, D., Kitada, H., Maeda, N., Fujimoto, K., Ramaswami, S., Sirajuddin, K., Yalamanchili, R., Eaton, B., Rajagopalan, N., Ding, R., Patel, S., Cao, Z., Gage, M., Wang, Y., Tu, W., Kim, S.W., Kulzer, R., Drucker, I., Erickson, D., Ritzdorf, T., Nakamura, T., and Ohba, T.
Published: 2012
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