1. Novel optical probing and micromachining techniques for silicon debug of flip chip packaged microprocessors
- Author
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Travis Eiles, Wai Mun Yee, Richard H. Livengood, Valluri R. Rao, Mario J. Paniccia, and Paul Winer
- Subjects
Materials science ,Silicon ,ComputingMethodologies_IMAGEPROCESSINGANDCOMPUTERVISION ,Physics::Optics ,chemistry.chemical_element ,Hardware_PERFORMANCEANDRELIABILITY ,Focused ion beam ,law.invention ,Computer Science::Hardware Architecture ,law ,Hardware_INTEGRATEDCIRCUITS ,Electrical and Electronic Engineering ,business.industry ,ComputingMethodologies_MISCELLANEOUS ,Far-infrared laser ,Condensed Matter Physics ,Laser ,Isotropic etching ,Atomic and Molecular Physics, and Optics ,Computer Science::Other ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Surface micromachining ,CMOS ,chemistry ,Optoelectronics ,business ,Flip chip - Abstract
Methods and techniques for micromachining and probing C4 packaged microprocessors from the silicon backside are described. The micromachining technique is based on using a combination of Laser Chemical Etching and Focused Ion Beam milling to open precision probe holes and perform circuit editing from the backside. A method to optically probe flip chip packaged CMOS microprocessors is also described. The optical probing technique utilizes an infrared laser to probe diffusions directly through the silicon backside without the need to mill probe holes.
- Published
- 1999
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