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This paper presents a direct 3D numerical simulation of biaxial surface wrinkling of thin metal film on a compliant substrate. The selected compliant substrate is a commercial Scotch tape on which a gold metal thin film has been transferred by using low adhesion between the thin metal film and polyimide substrate. Compared with the previous fabrication of a cylindrical thin-film wrinkling pattern, an undulated wrinkling pattern has been implemented by increasing the width of the thin metal film in order to create biaxial straining in the thin film. To understand the wrinkling behavior due to biaxial loading, a simple direct numerical simulation based on material imperfections defined in the compliant substrate has been conducted. Through modeling and simulation, it was found that the wrinkling mode is determined by the biaxiality ratio (BR), the ratio between transversal strain and longitudinal strain. Depending on the BR, the wrinkling mode belongs to one of the cylindrical, undulated (or herringbone), checkerboard, or labyrinth modes as a function of applied strain. The cylindrical wrinkling is dominant at the input of BR less than 0.5, while the undulated (or herringbone) ones become dominant just after the onset of the wrinkling pattern at BR greater than 0.9. Through the comparison of the wrinkling patterns between simulation and experiment, the applied BR of the fabricated thin film has been successfully estimated. [ABSTRACT FROM AUTHOR]

This paper presents a direct 3D numerical simulation of biaxial surface wrinkling of thin metal film on a compliant substrate. The selected compliant substrate is a commercial Scotch tape on which a gold metal thin film has been transferred by using low adhesion between the thin metal film and polyimide substrate. Compared with the previous fabrication of a cylindrical thin-film wrinkling pattern, an undulated wrinkling pattern has been implemented by increasing the width of the thin metal film in order to create biaxial straining in the thin film. To understand the wrinkling behavior due to biaxial loading, a simple direct numerical simulation based on material imperfections defined in the compliant substrate has been conducted. Through modeling and simulation, it was found that the wrinkling mode is determined by the biaxiality ratio (BR), the ratio between transversal strain and longitudinal strain. Depending on the BR, the wrinkling mode belongs to one of the cylindrical, undulated (or herringbone), checkerboard, or labyrinth modes as a function of applied strain. The cylindrical wrinkling is dominant at the input of BR less than 0.5, while the undulated (or herringbone) ones become dominant just after the onset of the wrinkling pattern at BR greater than 0.9. Through the comparison of the wrinkling patterns between simulation and experiment, the applied BR of the fabricated thin film has been successfully estimated.

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thin-film package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. Based on the simulation results, it is found that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. The mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along a polymeric sealing ring is found. [ABSTRACT FROM AUTHOR]

This paper presents a direct numerical simulation for the extraction of material properties based on thin-film wrinkling on scotch tape. Conventional FEM-based buckling simulation sometimes requires complex modeling techniques concerning mesh element manipulation or boundary conditions. The direct numerical simulation differs from FEM (finite element method)-based conventional two-step linear–nonlinear buckling simulation in that mechanical imperfections are directly applied into the elements of the simulation model. Hence, it can be performed in one step to find the wrinkling wavelength and amplitude, which are key parameters to extract the material mechanical properties. Moreover, the direct simulation can reduce simulation time and modeling complexity. Using the direct model, the effect of the number of imperfections on wrinkling characteristics was first studied, and then wrinkling wavelengths depending on the elastic moduli of the associated materials were prepared for the extraction of material properties. Thin-film wrinkling test patterns on scotch tape were fabricated using the transfer technique with low adhesion between metal films and the polyimide substrate. The material properties of the thin metal films were determined by comparing the measured wrinkling wavelengths and the proposed direct simulation results. By consequence, the elastic moduli of 300 nm thick gold film and 300 nm thick aluminum were determined as 250 GPa and 300 GPa, respectively. [ABSTRACT FROM AUTHOR]

This paper presents a 3D direct numerical simulation of buckled thin-film packaging based on transferred elastic thin-film wrinkling bonded on a compliant polymer ring. The mode change of the fabricated thin-film cap is found by measuring the thin-film cap shape at different times after Si substrate debonding. The conventional linear and nonlinear buckling simulations are not adequate to understand the behavior of the thin-film buckling mechanism creating such packaging cap mode change. Direct buckling simulation is recently reported as an easy and useful numerical wrinkling simulation method. A novel 3D FEM model of a thin-film package suitable for direct 3D buckling simulation is built to reduce the mode mixture between different buckling modes. Buckling modes of the packaging cap are investigated in terms of elastic moduli of package materials and applied strain due to thermal expansion coefficient difference. Based on the simulation results, it is found that there are two main modes in the fabricated thin-film buckling package determining the shape of the transferred thin-film packaging cover depending on the elasticity ratio between the cap and sealing ring materials. The mode shift from wrinkling cap mode to out-of-plane cap mode due to applied strain along a polymeric sealing ring is found.

This paper presents a direct numerical simulation for the extraction of material properties based on thin-film wrinkling on scotch tape. Conventional FEM-based buckling simulation sometimes requires complex modeling techniques concerning mesh element manipulation or boundary conditions. The direct numerical simulation differs from FEM (finite element method)-based conventional two-step linear–nonlinear buckling simulation in that mechanical imperfections are directly applied into the elements of the simulation model. Hence, it can be performed in one step to find the wrinkling wavelength and amplitude, which are key parameters to extract the material mechanical properties. Moreover, the direct simulation can reduce simulation time and modeling complexity. Using the direct model, the effect of the number of imperfections on wrinkling characteristics was first studied, and then wrinkling wavelengths depending on the elastic moduli of the associated materials were prepared for the extraction of material properties. Thin-film wrinkling test patterns on scotch tape were fabricated using the transfer technique with low adhesion between metal films and the polyimide substrate. The material properties of the thin metal films were determined by comparing the measured wrinkling wavelengths and the proposed direct simulation results. By consequence, the elastic moduli of 300 nm thick gold film and 300 nm thick aluminum were determined as 250 GPa and 300 GPa, respectively.