1. Experimental Study on Three-Dimensional Microstructure Copper Electroforming Based on 3D Printing Technology
- Author
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Hua Zhang, Mingyu Huang, Wu Yuanyuan, Shuangqing Qian, Cao Hongbei, and Yong Zhang
- Subjects
0209 industrial biotechnology ,three-dimensional microstructure ,Materials science ,business.industry ,Mechanical Engineering ,process parameters ,3D printing ,02 engineering and technology ,Substrate (printing) ,021001 nanoscience & nanotechnology ,Microstructure ,Article ,020901 industrial engineering & automation ,Control and Systems Engineering ,Duty cycle ,Electrode ,Electroforming ,electroforming ,Electrical and Electronic Engineering ,Composite material ,0210 nano-technology ,business ,Current density ,Layer (electronics) - Abstract
In order to fabricate three-dimensional metal microstructures, a combined machining process based on 3D printing technology and electroforming technology is proposed. Firstly, a substrate with microstructures is fabricated by 3D printing technology, and then the microstructures were fabricated by electroforming technology. The influence of process parameters such as current density, distance between electrodes and pulse current duty cycle on the electroformed layer were studied and analyzed. It was determined that the peak current density 6A/dm2, the void ratio 20%, and the distance between electrodes 40 mm were the optimum process conditions of electroforming experiment. The electroforming experiments of different microstructures were carried out with the optimum process parameters.
- Published
- 2019
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