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Abstract  From a production logistics point of view, micro production systems need special methods due to their special requirements and characteristics. In this paper a new approach for the assessment of different investment scenarios during the planning period with integrated cost simulation is presented. In particular, the use of single-purpose and multi-purpose machines and the cost effectiveness of function integration are examined. Thereby alternative machine pool configurations and optimal costs can be analysed, determined and taken into consideration for investment decisions. [ABSTRACT FROM AUTHOR]

Casting production of metallic and ceramic micro components is still in the research phase, and the components obtained with the current technologies are suffering of a certain lack of reproducibility. Within the scope of Collaborative Research Center 499 “Design, Production and Quality Assurance of Molded micro components made of Metallic and Ceramic Materials”, basics in a persistent process chain for micro components are acquired. The development, process preparation, mass production and material and components behavior investigation is understood under consistent chain. This work presents computer simulation based methods that contribute to optimize micro molded systems on both a component and a system basis. The introduction of such methods allows studying the behavior of components and systems with regard to their grain structure and the wide geometric tolerances required. [ABSTRACT FROM AUTHOR]

Abstract  The conventional exposed pad low-profile quad flat pack (E-pad LQFP) package is a low cost solution for multimedia chips, but its disadvantages are limited pin count and worse electrical characteristics. In order to increase their pin utilization rate and electrical characteristics for high-speed applications, an innovative leadframe package, named multiple exposed pads (M-pad) LQFP package, is proposed. By bonding all power and ground wires to their dedicated exposed pads, the leads originally bonded to the corresponding power and ground wires can be used as the spared leads for the other signals, or they can be just removed to reduce the lead numbers, and thus the size and cost of the M-pad leadframe package. The M-pad LQFP package was evaluated for manufacturing processes and electrical characteristics. The parasitics of power nets and S-parameters of high-speed differential signals were extracted using 3D electromagnetic field solvers. The simulated power parasitics of M-pad LQFP are much lower than those of E-pad LQFP and BGA packages. The simulated differential S-parameters of M-pad LQFP also indicate less signal loss compared with those of E-pad LQFP. The co-simulation of chip-(M-pad) package-board with multi-Gbps serial link was performed with well-behaved eye-diagrams that conform to high-definition multimedia interface (HDMI) specification. [ABSTRACT FROM AUTHOR]