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Generally, a backlight unit (BLU) is considered for the light module of a thin film transistor (TFT) LCD. A typical BLU is comprised of a light guide plate (LGP) and some optical sheets, such as two diffusion sheets, two prism sheets and a reflection sheet. To make the traditional BLU thinner and brighter, we develop an integrated LED-backlight plate (BLP) on microstructures-based, which combine several functions of optical sheets to save the space and fabrication process. The microstructures and the reflective thin film are constructed on the BLP by using micromachining and hot-embossing techniques in the research. From the results of luminous measurements, the luminous uniformity of 86.1% of our fabricated BLP has achieved a demand of a general panel. In future, the micromachining BLP could make the LED-backlight thinner, brighter and lighter for mobile phone applications.

Generally, injection molding technique is applied to fabricate the traditional light guiding plate (LGP). MEMS and hot-embossing techniques applied to fabricate the concentric circle light guiding plate (CCLGP) in this research. The concentric circle v-groove structure and the micro-pyramid structure are constructed on the CCLGP. Therefore, the new backlight module could be simplified to use on only one integrated LGP with any optical components. The CCLGP can eliminate four optical components including the two diffusive sheets and two prism sheets in backlight module, so the space and the fabricated cost of the backlight unit are saved. From the test results, the CCLGP is demonstrated successfully of guide light function and the 82% of illuminative uniformity of the CCLGP is better than the other LGP.