1. Atomic Au 3 Cu Palisade Interlayer in Core@Shell Nanostructures for Efficient Kirkendall Effect Mediation.
- Author
-
Hou T, Li X, Zhang X, Cai R, Wang YC, Chen A, Gu H, Su M, Li S, Li Q, Zhang L, Haigh SJ, and Zhang J
- Abstract
Plasmonic Cu@semiconductor heteronanocrystals (HNCs) have many favorable properties, but the synthesis of solid structures is often hindered by the nanoscale Kirkendall effect. Herein, we present the use of an atomically thin Au
3 Cu palisade interlayer to reduce lattice mismatch and mediate the Kirkendall effect, enabling the successive topological synthesis of Cu@Au3 Cu@Ag, Cu@Au3 Cu@Ag2 S, and further transformed solid Cu@Au3 Cu@CdS core-shell HNCs via cation exchange. The atomically thin and intact Au3 Cu palisade interlayer effectively modulates the diffusion kinetics of Cu atoms as demonstrated by experimental and theoretical investigations and simultaneously alleviates the lattice mismatch between Cu and Ag as well as Cu and CdS. The Cu@Au3 Cu@CdS HNCs feature exceptional crystallinity and atomically organized heterointerfaces between the plasmonic metal and the semiconductor. This results in the efficient plasmon-induced injection of hot electrons from Cu@Au3 Cu into the CdS shell, enabling the Cu@Au3 Cu@CdS HNCs to achieve high activity and selectivity for the photocatalytic reduction of CO2 to CO.- Published
- 2024
- Full Text
- View/download PDF