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Characteristics of atomic layer deposition (ALD)-grown ZnO thin films on sapphire substrates with and without three-pulsed ozone (O 3 ) as oxidant precursor and post-deposition thermal annealing (TA) are investigated. Deposition temperature and thickness of ZnO epilayers are 180 °C and 85 nm, respectively. Post-deposition thermal annealing is conducted at 300 °C in the ambience of oxygen (O 2 ) for 1 h. With strong oxidizing agent O 3 and post-deposition TA in growing ZnO, intrinsic strain and stress are reduced to 0.49% and 2.22 GPa, respectively, with extremely low background electron concentration (9.4 × 10 15  cm -3 ). This is originated from a lower density of thermally activated defects in the analyses of thermal quenching of the integrated intensity of photoluminescence (PL) spectra. TA further facilitates recrystallization forming more defect-free grains and then reduces strain and stress state causing a remarkable decrease of electron concentration and melioration of surface roughness.

Based on time-resolved electroluminescence (TREL) measurement, more efficient carrier injection, transport, relaxation, and recombination associated with a stronger carrier localization and a low polarization effect in a nonpolar m-plane InGaN/GaN light emitting diode (m-LED), compared with those in a polar c-LED, are reported. With a higher applied voltage in the c-LED, decreasing response time and rising time improve device performance, but a longer recombination time degrades luminescence efficiency. By using an m-LED with a stronger carrier localization and a low polarization effect, shorter response, rising, and recombination times provide more efficient carrier injection, transport, relaxation, and recombination. These advantages can be realized for high-power and high-speed flash LEDs. In addition, with a weaker carrier localization and a polarization effect in the c-LED, the slower radiative and faster nonradiative decay rates at a larger applied voltage result in the slower total decay rate and the lower luminescence efficiency. For the m-LED at a higher applied voltage, a slow decreasing nonradiative decay rate is beneficial to device performance, while the more slowly decreasing and overall faster radiative decay rate of the m-LED than that of the c-LED demonstrates that a stronger carrier localization and a reduced polarization effect are efficient for carrier recombination. The resulting recombination dynamics are correlated with the device characteristics and performance of the c- and m-LEDs.

In this study, effects of the thickness of a low temperature (LT) buffer and impurity incorporation on the characteristics of Nitrogen (N)-polar GaN are investigated. By using either a nitridation or thermal annealing step before the deposition of a LT buffer, three N-polar GaN samples with different thicknesses of LT buffer and different impurity incorporations are prepared. It is found that the sample with the thinnest LT buffer and a nitridation step proves to be the best in terms of a fewer impurity incorporations, strong PL intensity, fast mobility, small biaxial strain, and smooth surface. As the temperature increases at ~10 K, the apparent donor-acceptor-pair band is responsible for the decreasing integral intensity of the band-to-band emission peak. In addition, the thermal annealing of the sapphire substrates may cause more impurity incorporation around the HT-GaN/LT-GaN/sapphire interfacial regions, which in turn may result in a lower carrier mobility, larger biaxial strain, larger bandgap shift, and stronger yellow luminescence. By using a nitridation step, both a thinner LT buffer and less impurity incorporation are beneficial to obtaining a high quality N-polar GaN.

Numerical simulations are conducted to study the current-matching effect and operation mechanisms in and to design the optimized device structure of InGaN/Si tandem cells. The characteristics of short circuit current density (J sc), open circuit voltage (V oc), fill factor (FF), and conversion efficiency (η) of InGaN/Si tandem cells are determined by the current-matching effect. The similar trend of η to that of J sc shows that J sc is a dominant factor in determining the performance of InGaN/Si tandem cells. In addition, the combined effects of the J sc, V oc, and FF lead to an optimized η in the medium-indium, [Formula: see text], InGaN/Si tandem cell. At [Formula: see text], the J sc of the InGaN subcell is equal to that of the Si subcell such that an InGaN/Si tandem cell reaches the current matching condition to operate at the maximum power point. Similar to the J sc and FF, the η for low- [Formula: see text] and high-In [Formula: see text] InGaN/Si tandem cells are InGaN- and Si subcell-limited, respectively. Furthermore, the p- and n-layer thicknesses, indium content, and position of depletion region of InGaN subcell should be adjusted to reapportion the light between the two subcells and to achieve the maximum conversion efficiency. With appropriate thicknesses of p- and n-InGaN, In0.5-0.6Ga0.5-0.4 N/Si tandem cells can exhibit as high as approximately 34% to 36.5% conversion efficiency, demonstrating that a medium-indium InGaN/Si tandem cell results in a high-efficiency solar cell. Simulation results determine that the current-matching effect and operation mechanisms of InGaN/Si tandem cells can be utilized for efficiency enhancement through the optimized device structures.