1. In-vacancies in Si-doped InN
- Author
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Christopher F McConville, Filip Tuomisto, William J. Schaff, Christian Rauch, Stanislav Sojak, Werner Egger, Hai Lu, Gregor Koblmüller, James S. Speck, Tim D. Veal, Benjamin Löwe, L. Ravelli, Floris Reurings, and C. S. Gallinat
- Subjects
ta214 ,Materials science ,ta114 ,InN ,ta221 ,Doping ,Analytical chemistry ,vacancy ,Surfaces and Interfaces ,Substrate (electronics) ,Condensed Matter Physics ,Crystallographic defect ,Surfaces, Coatings and Films ,Electronic, Optical and Magnetic Materials ,Positron ,Vacancy defect ,Materials Chemistry ,positron ,Si ,Electrical and Electronic Engineering ,Atomic physics ,Layer (electronics) ,ta218 ,Doppler broadening ,Molecular beam epitaxy - Abstract
The introduction of vacancy type point defects by Si doping in InN grown by plasma-assisted molecular beam epitaxy was studied using a monoenergetic positron beam. With the combination of positron lifetime and Doppler broadening measurements, compensating In-vacancy (V(In)) acceptors were identified in the material. For increasing Si doping an enhanced formation of V(In), defects was observed, up to a concentration of c(V) = 7 x 10(17) cm(-3) in the highest doped sample (n(e) = 6.6 x 10(20) cm(-3)). A strong inhomogeneity of the defect profile with a significant increase of the V(In), concentration toward the layer/substrate interface could be detected. Additionally, larger vacancy clusters containing several V(In) are formed in the proximity of the interface. (C) 2010 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
- Published
- 2010