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The emission performance of c‐sapphire‐grown deep‐UV (DUV) light‐emitting diodes (LEDs) at 254 and 258 nm is particularly poor. To overcome this critical limitation, herein, the influence of the Mg‐dopant concentration in a p‐AlGaN hole source layer (HSL) on donor–acceptor pair emission from solid‐state AlGaN‐based DUV LEDs in the 254–258 nm band is investigated. Further, the influence of substrate growth temperature (TS) on the photoluminescence (PL) emission efficiency and external quantum efficiency (EQE) is investigated. When the TS is increased from 1140 to 1170 °C for a p‐AlGaN HSL with a low Mg‐dopant concentration (70 sccm), the maximum power outputs of the fabricated DUV LED at the single peak emissions of 254 and 258 nm are enhanced to 3.4 and 14 mW, respectively. Moreover, the maximum EQE of the 254 and 258 nm‐band DUV LEDs increases by ≈1.2% and 2.2%, respectively, on the wafer during both continuous‐wave and pulsed operation at room temperature. [ABSTRACT FROM AUTHOR]

The epitaxial growth of transparent p‐AlGaN‐based ultraviolet‐A (UVA), light‐emitting diodes (LEDs) may solve the problems of UVA light absorption through the GaN buffers and p‐GaN contact layers at (326–341 nm)‐band emission, respectively. Herein, first, an idea of conventional n‐AlGaN buffer layer (BL) and n‐AlGaN electron source layer (ESL) for the suppression of threading dislocation density (TDD) and enhancement of internal quantum efficiency (IQE) of UVA emitters, using low‐pressure metalorganic vapor‐phase epitaxy (LP‐MOVPE) is attempted. As a result, the total‐TDDs is reduced from ≈ 3 × 109 cm−2 to ≈ 1 × 109 cm−2 in the n‐AlGaN ESL of a 326 nm‐band UVA multiquantum‐wells (MQWs), and IQE is also improved from 30% to 52% at room temperature (RT). Second, an idea of Si‐doped n‐AlGaN Superlattices (SLs)‐based BL, using LP‐MOVPE is challenged. Subsequently, a record IQE of 56% at RT and high crystal quality in 341 nm‐band UVA MQWs are observed. Finally, using a well thickness ≈ 2 nm in SLs‐based UVA MQWs, the light power and external quantum efficiency (EQE), respectively, are remarkably enhanced from 3.5 mW and 0.5% to 7.5 mW and 1.4% on wafer in 341 nm‐Band UVA LED. The perspective for the improvements of UVA emitter's performances is also discussed. [ABSTRACT FROM AUTHOR]

AlGaN‐based deep‐ultraviolet light‐emitting diodes (DUV LEDs) have a wide range of applications and a large market is expected. However, the efficiency of DUV LEDs is still much lower than that of blue LEDs due to the quite low light‐extraction efficiency (LEE). We are developing high LEE DUV LEDs by introducing a transparent contact layer and a highly reflective Ni/Al p‐type electrode. In this work, we investigate optimization of the Ni layer thickness of the highly reflective Ni/Al p‐type electrode for AlGaN DUV LEDs. We find that the reflectivity in the UV region becomes higher as the thickness of the Ni layer becomes smaller; however, the external quantum efficiency (EQE) is reduced if the Ni layer is too thin (<0.8 nm). As a result, we find that the most appropriate Ni thickness for the Ni/Al electrode is 0.9 nm. We fabricate 279 nm AlGaN quantum well (QW) DUV LEDs with the optimized electrodes and demonstrate an enhancement in EQE by a factor of 1.8 and a maximum EQE of 9% under bare wafer measurement conditions. We also demonstrate a high output power of 33 mW under an injection current of 100 mA. [ABSTRACT FROM AUTHOR]

AlGaN based deep‐ultraviolet light‐emitting diodes (DUV‐LEDs) have a wide range of applications and a large market is expected. However, the efficiency of DUV‐LEDs is still much lower than that of blue LEDs due to a quite low light‐extraction efficiency (LEE). We improved the LEE of DUV‐LEDs by using a superlattice (SL) hole spreading p‐AlGaN contact layer, a dot matrix Ni/Au electrode and an Al reflector. DUV‐LED samples in which the SL p‐AlGaN contact layer has various period lengths, and forms two different p‐type electrodes, a conventional Ni/Au electrode and a dot matrix Ni/Au electrode with an Al reflector are fabricated. By comparing these LED samples, it is confirmed that contact layers with relatively longer periods are suitable both for vertical hole injection and lateral spreading of the holes. By increasing the Al content and recovering the transparency of the SL p‐AlGaN contact layer, the LEE is increased by up to a factor of 1.6. [ABSTRACT FROM AUTHOR]

Aluminium gallium nitride (AlGaN)‐based ultraviolet‐B light‐emitting diodes (UVB LEDs) are expected to offer smart size, wider choice of UVB light emission in the wavelengths range of 280 nm > λ > 320 nm, and low cost as well as low power consumption compared with other UV light sources including toxic mercury UV‐lamps. The hole‐tunneling from p‐AlGaN side of UVB LED into the multi‐quantum‐wells (MQWs) is strongly dependent on the thickness (TFB) and Al‐contents of undoped (ud)‐AlGaN final barrier (FB). Herein, the photoluminescence (PL) efficiency from MQWs of the UVB LED devices is investigated and compared with the electroluminescence (EL) spectra as a function of TFB. Subsequently, the dependence of PL efficiency, external quantum efficiency (EQE), and light output power on the TFB of UVB LEDs is attempted, using the same growth condition for all samples except variation in TFB. When TFB is set to 6–7 nm, improvements in the EQE and light output power, respectively, from 4.3% and 7 mW to the high values of 5.6% and 17 mW in emission band of 295–300 nm under continuous‐wave (cw) at room temperature (RT) are achieved. [ABSTRACT FROM AUTHOR]