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With the rapid growth of highly integrated electrical devices, the urgent demand for polymer composites with high thermal conductivity (TC) is increasing for effective thermal management. In this work, boron nitride nanosheets (BNNSs) were chemically grafted with aluminum oxide (Al2O3) to develop hetero‐structured filler (BNNSs@Al2O3). The BNNSs@Al2O3 fillers were uniformly dispersed in the poly(vinyl alcohol) (PVA) by solvent mixing, verified by SEM, and the oriented BNNSs@Al2O3/PVA composites were produced by the doctor blade method. The results exhibited that the synergistic effect of BNNSs and Al2O3 was achieved, and the thermal conductivities of BNNSs@Al2O3/PVA composites were improved. When keeping the filler content at 30 wt%, the in‐plane and out‐of‐plane TC of BNNSs@Al2O3/PVA composite reached 5.641 and 0.651 W/(m·K), respectively. The BNNSs@Al2O3 filler may improve the performance of composite heat dissipation by reducing the interfacial resistance between fillers and making it easier to establish directed heat‐transfer pathways. This composite demonstrates promising application in the field of electronic packaging. [ABSTRACT FROM AUTHOR]

In this research, the different weight percentages of alumina and graphene nanoplatelets were homogeneously dispersed in the epoxy resin by a sonication and ball milling mixing process. The effect alumina and graphene nanoplatelets filled epoxy nanocomposites of physical, flexural, and dynamic mechanical properties were investigated. The epoxy nanocomposites showed a significant enhancement of 43.5% flexural strength and 29.5% flexural modulus for the combined filler loading of 2 wt% of alumina and 0.5 wt% of graphene nanoplatelets sample (EA2G0.5) than the neat epoxy. The EA2G0.5 epoxy nanocomposites sample showed an enhancement of 68.1% for the storage modulus. The loss modulus peak shifts toward the right side than the neat epoxy, which is showing better thermal stability of the composite. The differential scanning calorimetry technique was used to study the curing characteristics of the epoxy and epoxy nanocomposites. The scanning electron microscopy images of a fractured surface of the neat epoxy and alumina and graphene nanoplatelets filled epoxy nanocomposites showed the dispersion of the fillers, which is the sole cause of the enhancement of flexural properties. In general, these developed nanocomposites are suitable to be used as parent material in electrical and electronic packaging applications. [ABSTRACT FROM AUTHOR]