Search

This study addresses the limitations of traditional polyimides (PIs) in high-frequency and high-temperature soft electronic applications, and then introducing trifluoromethylbenzene (TFMB) into the molecular structure and employing various diamines as connecting components to solve the bottleneck. The innovative molecular design enhances thermal, mechanical, and dielectric properties, overcoming challenges in balancing these performances. The optimized fluorinated PI (TPPI50) exhibits exceptional properties, including a glass transition temperature of 402 °C, thermal decomposition temperature of 563 °C, tensile strength of 232.73 MPa, elongation at break of 26.26%, and dielectric constant of 2.312 at 1 MHz with a dielectric loss as low as 0.00676. These improvements are attributed to the unique synergy between TFMB's fluorinated groups, which reduce molecular polarization, and the biphenyl structure, which reinforces chain stability. Compared to conventional PIs, TPPI50 demonstrates superior comprehensive performance, making it highly suitable for soft circuits, high-frequency signal transmission, and advanced applications such as wearable devices and biosensors. This study provides a robust framework for industrial applications, offering a path to next-generation soft electronics with enhanced reliability and performance.

A series of epoxy resins containing various trifluoromethyl groups were synthesized and thermally cured with diaminodiphenylmethane (DDM) and aminophenyl sulfone (DDS). All epoxy resins exhibited excellent thermal stability with the glass transition temperatures of above 128 °C and 5% weight loss temperatures of above 300 °C. DDS-cured epoxy resins possessed higher thermal stability than that of DDM-cured epoxy resins, while DDM-cured epoxy resins showed better mechanical, dielectric, and hydrophobic properties. Additionally, DDM-cured epoxy resins with different locations and numbers of trifluoromethyl groups showed flexural strength in the range of 95.55~152.36 MPa, flexural modulus in the range of 1.71~2.65 GPa, dielectric constant in the range of 2.55~3.05, and water absorption in the range of 0.49~0.95%. These results indicate that the incorporation of trifluoromethyl pendant groups into epoxy resins can be a valid strategy to improve the dielectric and hydrophobic performance.

In this study, a novel diamine monomer containing ester and phenyl moieties, 1,2-diphenylethane-1,2-diyl bis(4-aminobenzoate) (1,2-DPEDBA), was synthesized through a three-step reaction. Using this diamine, a novel polyimide (PI) film was prepared with 4,4'-(hexafluoroisopropylidene)diphthalic anhydride (6-FDA) as a counter dianhydride through a typical two-step chemical imidization. For comparison, poly(pyromellitic dianhydride-co-4,4'-oxydianiline) (PMDA-ODA PI) was also synthesized via thermal imidization. The resulting 6-FDA-DPEDBA PI film was not only soluble in common polar solvents with high boiling points, such as N,N-dimethylacetamide (DMAc) and N,N-dimethylformamide (DMF), but also soluble in common low-boiling-point polar solvents, such as chloroform (CHCl 3 ) and dichloromethane (CH 2 Cl 2 ), at room temperature. The resulting novel PI showed a 5% weight loss temperature (T 5 ) at 360 °C under a nitrogen atmosphere. The resulting PI film was colorless and transparent with a transmittance of 87.1% in the visible light region ranging from 400 to 760 nm. The water absorption of the novel PI film was of 1.78%. The PI film also possessed a good moisture barrier and hydrophobicity. Furthermore, the resulting PI film displayed a low dielectric constant of 2.17 at 10 d ) at 360 °C under a nitrogen atmosphere. The resulting PI film was colorless and transparent with a transmittance of 87.1% in the visible light region ranging from 400 to 760 nm. The water absorption of the novel PI film was of 1.78%. The PI film also possessed a good moisture barrier and hydrophobicity. Furthermore, the resulting PI film displayed a low dielectric constant of 2.17 at 10 6 Hz at room temperature. In conclusion, the novel PI film exhibited much better optical transparency, lower moisture absorption, and a lower dielectric constant as well as better solubility than the PMDA-ODA PI film, which is insoluble in any solvent, although its thermal stability is not better than that of PMDA-ODA PI.

Irradiation is a good modification technique, which can be used to modify the electrical properties, mechanical properties, and thermal properties of polymer materials. The effects of irradiation on the electrical properties, mechanical properties, and structure of polyimide (PI) films were studied. PI films were irradiated by a 1 MeV electron, 3 MeV proton, 10 MeV proton, and 25 MeV carbon ion. Dielectric constant, dielectric loss, and resistance measurements were carried out to evaluate the changes in the electrical properties; moreover, the mechanical properties of the pristine and irradiated PI were analyzed by the tensile testing system. The irradiation induced chemical bonds and free radicals changes of the PI films were confirmed by the Fourier transform infrared (FTIR) spectra, X-ray photoelectron spectroscopy (XPS), and electron paramagnetic resonance (EPR). The dielectric constant of the PI films decreases with the increase of fluences by the four kinds of irradiation sources.

A novel poly(arylene ether nitrile) terminated with hydroxyl groups (PEN-OH) was synthesized successfully. The effects of heat-treatment temperature on the thermal properties, mechanical properties, and dielectric properties of the PEN-OH films were studied in detail. Due to the cross-linking reaction occurring, at high temperature, among the nitrile groups on the side of the PEN-OH main chain to form a structurally stable triazine ring, the structure of materials changes from a linear structure to a bulk structure. Thus, the thermal properties and mechanical properties were improved. In addition, the occurrence of cross-linking reactions can reduce the polar groups in the material, leading to the decrease of dielectric constant. As the heat-treatment temperature increased, the glass-transition temperature increased from 180.6 °C to 203.6 °C, and the dielectric constant decreased from 3.4 to 2.8 at 1 MHz. Proper temperature heat-treatment could improve the tensile strength, as well as the elongation, at the break of the PEN-OH films. Moreover, because of the excellent adhesive property of PEN-OH to copper foil, a double-layer flexible copper clad laminate (FCCL) without any adhesives based on PEN-OH was prepared by a simple hot-press method, which possessed high peel strength with 1.01 N/mm. Therefore, the PEN-OH has potential applications in the electronic field.

In spite of the progress that has made so far in the recent years regarding the synthesis of bio-based polymers and in particular polyesters, only few references address the optimisation of these new reactions with respect to conversion and reaction time. Related to this aspect, we here describe the transesterification reaction of two different acetalised galactarate esters with a model aliphatic diol, 1,6-hexanediol. The kinetics of these two apparently similar reactions is compared, with a focus on the conversion while varying the concentration of a di-butyltin oxide catalyst (DBTO), respectively, the used N₂ flow-rate. During the first stage of polymerisation, the molecular weight of the end-products is more than doubled when using a 250 mL/min flow as opposed to an almost static N₂ pressure. Additionally, the resulted pre-polymers are subjected to further polycondensation and the comparison between the obtained polyesters is extended to their thermal, mechanical and dielectrical characterisation. The influence of the acetal groups on the stability of the polyesters in acidic conditions concludes the study., Competing Interests: The authors declare no conflict of interest