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Optically transparent polyimide (PI) films with good atomic oxygen (AO) resistance have been paid extensive attention as thermal controls, optical substrates for solar cells or other components for low Earth orbit (LEO) space applications. However, for common PI films, it is usually quite difficult to achieve both high optical transparency and AO resistance and maintain the intrinsic thermal stability of the PI films at the same time. In the current work, we aimed to achieve the target by using the copolymerization methodology using the fluorinated dianhydride 9,9-bis(trifluoromethyl)xanthene-2,3,6,7-tetracarboxylic dianhydride (6FCDA), the fluorinated diamine 2,2-bis [4-(4-aminophenoxy)phenyl]hexafluoropropane (BDAF) and the polyhedral oligomeric silsesquioxane (POSS)-containing diamine N-[(heptaisobutyl-POSS)propyl]-3,5-diaminobenzamide (DABA-POSS) as the starting materials. The fluoro-containing monomers were used to endow the PI films with good optical and thermal properties, while the silicon-containing monomer was used to improve the AO resistance of the afforded PI films. Thus, the 6FCDA-based PI copolymers, including 6FCPI-1, 6FCPI-2 and 6FCPI-3, were prepared using a two-step chemical imidization procedure, respectively. For comparison, the analogous PIs, including 6FPI-1, 6FPI-2 and 6FPI-3, were correspondingly developed according to the same procedure except that 6FCDA was replaced by 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA). Two referenced PI homopolymers were prepared from BDAF and 6FDA (PI-ref1) and 6FCDA (PI-ref2), respectively. The experimental results indicated that a good balance among thermal stability, optical transparency, and AO resistance was achieved by the 6FCDA-PI films. For example, the 6FCDA-PI films exhibited good thermal stability with glass transition temperatures (Tg) up to 297.3 °C, good optical transparency with an optical transmittance at a wavelength of 450 nm (T450) higher than 62% and good AO resistance with the erosion yield (Ey) as low as 1.7 × 10−25 cm3/atom at an AO irradiation fluence of 5.0 × 1020 atoms/cm2. The developed 6FCDA-PI films might find various applications in aerospace as solar sails, thermal control blankets, optical components and other functional materials. [ABSTRACT FROM AUTHOR]

Colorless and transparent polyimide (CPI) films with good atomic oxygen (AO) resistance and high thermal endurance are highly required in low earth orbit (LEO) space exploration. Conventional CPI films based on fluoro-containing 4,4′-(hexafluoroisopropylidene)diphthalic anhydride (6FDA) have been widely used in space applications. However, the AO erosion yields and glass transition temperatures (Tg) of the 6FDA-based CPI films have to be modified in order to meet the severe serving environments. In the current work, novel CPI films based on a multi-ring fluoro-containing 9,9-bis(trifluoromethyl)xanthene-2,3,6,7-tetracarboxylicdianhydride (6FCDA) monomer were developed. In order to enhance the AO resistance of the derived CPI film, a phosphorus-containing aromatic diamine, 2,5-bis[(4-aminophenoxy)phenyl]diphenylphosphine oxide (BADPO) was used to polymerize with the dianhydride to create the organo-soluble resin. Then, two phosphorus-containing CPI films (PPI), including PPI-1 (6FDA-BADPO) and PPI-2 (6FCDA-BADPO) were prepared by thermally curing of the PPI solutions at elevated temperatures. The PPI films maintained good optical transparency with transmittance values over 80% at a wavelength of 450 nm. PPI-2 exhibited a Tg value of 311.0 °C by differential scanning calorimetry (DSC) measurement, which was 46.7 °C higher than that of the PPI-1 counterpart (Tg = 264.3 °C). In addition, the PPI-2 film showed a coefficient of linear thermal expansion (CTE) value of 41.7 × 10−6/K in the range of 50~250 °C, which was apparently lower than that of the PPI-1 sample (CTE = 49.2 × 10−6/K). Lastly, both of the two PPI films exhibited good AO resistance with the erosion yields (Ey) of 6.99 × 10−25 cm3/atom for PPI-1 and 7.23 × 10−25 cm3/atom for PPI-2 at an exposure flux of 5.0 × 1020 atoms/cm2. The Ey values of the current PPI films were obviously lower than that of the standard polyimide (PI) film based on pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) (Ey = 3.0 × 10−24 cm3/atom). [ABSTRACT FROM AUTHOR]

Polymeric optical films with light colors, good optical transparency and high thermal resistance have gained increasing attention in advanced optoelectronic areas in recent years. However, it is somewhat inter-conflicting for achieving the good optical properties to the conventional thermal resistant polymers, such as the standard aromatic polyimide (PI) films, which are well known for the excellent combined properties and also the deep colors. In this work, a series of wholly aromatic PI films were prepared via the polycondensation chemistry of one fluorene-containing dianhydride, 9,9-bis(3,4-dicarboxyphenyl)fluorene dianhydride (FDAn) and several aromatic diamines with amide linkages in the main chain, including 9,9-bis [4-(4-aminobenzamide)phenyl]fluorene (FDAADA), 2,2′-bis(trifluoromethyl)-4,4′-bis[4-(4-aminobenzamide)] biphenyl (ABTFMB), and 2,2′-bis(trifluoromethyl)-4,4′-bis[4-(4-amino-3-methyl)benzamide] biphenyl (MABTFMB). The derived FLPI-1 (FDAn-FDAADA), FLPI-2 (FDAn-ABTFMB) and FLPI-3 (FDAn-MABTFMB) resins showed good solubility in the polar aprotic solvents, such as N-methyl-2-pyrrolidone (NMP), N,N-dimethylacetamide (DMAc) and dimethyl sulfoxide (DMSO). The solution-processing FDAn-PI films exhibited good optical transmittance over 80.0% at a wavelength of 500 nm (T500), yellow indices (b*) in the range of 1.01–5.20, and haze values lower than 1.0%. In addition, the FDAn-PI films showed low optical retardance with optical retardation (Rth) values in the range of 31.7–390.6 nm. At the same time, the FDAn-PI films exhibited extremely high glass transition temperatures (Tg) over 420 °C according to dynamic mechanical analysis (DMA) tests. The FDAn-PI films showed good dimensional stability at elevated temperatures with linear coefficients of thermal expansion (CTE) in the range of (31.8–45.8) × 10−6/K. [ABSTRACT FROM AUTHOR]

Polyimide (PI) optical films with high glass transition temperatures (high-Tg), high optical transparency, and low optical retardations (low-Rth) are highly desired in advanced optoelectronic applications. However, the standard PI films usually suffer from deep colors, high optical anisotropies and limited Tg values. In the current work, a series of semi-alicyclic colorless and transparent PI (CPI) films were developed from hydrogenated pyromellitic dianhydride stereoisomers, 1S,2R,4S,5R-hydrogenated pyromellitic dianhydride and 1R,2S,4S,5R-hydrogenated pyromellitic dianhydride, and fluorene-containing diamines, including 9,9-bis(4-aminophenyl)fluorene and 9,9-bis(3-fluoro-4-aminophenyl)fluorene, respectively. The derived CPI films showed Tg values higher than 420 °C according to differential scanning calorimetry measurements. In addition, the fluorene-based CPI film showed optical transmittances higher than 80% at the wavelength of 400 nm, with yellow indices in the range of 0.60~1.01 and haze values below 3.0%. The CPI films showed average refractive indices from 1.5407 to 1.6309, extremely low birefringence at the level of minus fourth power of ten, and further exhibited quite low optical retardations below 10 nm. [ABSTRACT FROM AUTHOR]

Light-colored and transparent polyimide (PI) films with good high-temperature dimensional stability are highly desired for advanced optoelectronic applications. However, in practice, the simultaneous achievement of good optical and thermal properties in one PI film is usually difficult due to the inter-conflicting molecular design of the polymers. In the present work, a series of PI-SiO2 nanocomposite films (ABTFCPI) were developed based on the PI matrix derived from hydrogenated pyromellitic anhydride (HPMDA) and an aromatic diamine containing benzanilide and trifluoromethyl substituents in the structure, 2,2′-bis(trifluoromethyl)-4,4′-bis [4-(4-aminobenzamide)]biphenyl (ABTFMB). The inorganic SiO2 fillers were incorporated into the nanocomposite films in the form of colloidal nanoparticles dispersed in the good solvent of N,N-dimethylacetamide (DMAc) for the PI matrix. The derived ABTFCPI nanocomposite films showed good film-forming ability, flexible and tough nature, good optical transparency, and good thermal properties with loading amounts of SiO2 up to 30 wt% in the system. The ABTFCPI-30 film with a SiO2 content of 30 wt% in the film showed an optical transmittance of 79.6% at the wavelength of 400 nm (T400) with a thickness of 25 μm, yellow index (b*) of 2.15, and 5% weight loss temperatures (T5%) of 491 °C, which are all comparable to those the pristine ABTFCPI-0 matrix without filler (T400 = 81.8%; b* = 1.77; T5% = 492 °C). Meanwhile, the ABTFCPI-30 film exhibited obviously enhanced high-temperature dimensional stability with linear coefficients of thermal expansion (CTE) of 25.4 × 10−6/K in the temperature range of 50 to 250 °C, which is much lower than that of the AMTFCPI-0 film (CTE = 32.7 × 10−6/K). [ABSTRACT FROM AUTHOR]

As an alternative to traditional riveting and welding materials, high-temperature-resistant adhesives, with their unique advantages, have been widely used in aviation, aerospace, and other fields. Among them, polyimide (PI) adhesives have been one of the most studied species both from basic and practical application aspects. However, in the main applications of solvent-type PI adhesives, pinholes or bubbles often exist in the cured PI adhesive layers due to the solvent volatilization and dehydration reaction, which directly affect the adhesive performance. To address this issue, electrospun PI nanofibrous membranes (NFMs) were employed as solvent-free or solvent-less adhesives for stainless steel in the current work. To enhance the adhesion of PI adhesives to the metal substrates, phenolphthalein groups and flexible ether bonds were introduced into the main chain of PIs via the monomers of 4,4′-oxydiphthalic anhydride (ODPA) and 3,3-bis[4-(4-aminophenoxy)phenyl] phthalide (BAPPT). At the same time, the methylethynyl group was used as the end-capping component, and the crosslinking reaction of the alkynyl group at high temperature further increased the adhesive strength of the PI adhesives. Three kinds of methylethynyl-terminated PI (METI) NFMs with the set molecular weights of 5000, 10,000, and 20,000 g/mol were first prepared via the one-step high-temperature polycondensation procedure. Then, the PI NFMs were fabricated via the standard electrospinning procedure from the soluble METI solutions. The afforded METI NFMs showed excellent melt-flowing behaviors at high temperature. Incorporation of the methylethynyl end-capping achieved a crosslinking reaction at 280−310 °C for the NFMs, which was about 70 °C lower than those of the phenylacetylene end-capping counterparts. Using the METI NFMs as adhesive, stainless steel adherends were successfully bonded, and the single-lap shear strength (LSS) was higher than 20.0 MPa at both room temperature (25 °C) and high temperature (200 °C). [ABSTRACT FROM AUTHOR]

Black polymer films with high thermal stability are highly desired in flexible electrical and electronic fields. Conventional black polymer films based on high-temperature resistant polymers and black inorganic dyes are usually suffered from the poor electrical and tensile properties. In the current work, a series of intrinsically black polyimide (BPI) films with International Commission on Illumination (CIE) Lab optical parameters close to zero and high thermal stability have been designed and prepared. For this purpose, an electron-rich aromatic diamine, 4,4′-iminodianiline (NDA), was copolymerized with 1,4-phenylenediamine (PDA) and 3,3′,4,4′-biphenyltetracarboxylic dianhydride (sBPDA) to afford a series of poly(amic acid) (PAA) solutions, which were then thermally dehydrated to provide the final BPI films at elevated temperatures up to 400 °C in air. The molar fraction of NDA in the total diamine monomers was 0 for BPI-0 (sBPDA-PDA), 10% for BPI-1, 20% for BPI-2, 30% for BPI-3, 40% for BPI-4, 50% for BPI-5, and 100% for BPI-6. For comparison, two referenced polyimide (PI) films, including PI-ref1 and PI-ref2, were prepared according to a similar procedure. The former was derived from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline (ODA) and the latter was from PMDA and NDA. The BPI films exhibited an increasing degree of blackness with the increasing contents of NDA units in the polymer films. For example, the BPI-6 (sBPDA-NDA) film exhibited the optical transmittance of 1.4% at a wavelength of 650 nm (T650), which was obviously lower than those of PI-ref1 (T650 = 74.6%) and PI-ref2 (T650 = 3.6%). In addition, the BPI-6 film showed the CIE Lab parameters of 0.39 for L*, 2.65 for a*, 0.66 for b*, and haze of 1.83, which was very close to the criterion of "pure blackness" for polymer films (L* = a* = b* = 0). At last, incorporation of the NDA units in the rigid-rod BPI-0 (BPDA-PDA) film slightly deteriorated the high-temperature dimensional stability of the derived BPI films. BPI-6 film showed a linear coefficient of thermal expansion (CTE) value of 34.8 × 10−6/K in the temperature range of 50 to 250 °C, which was higher than those of the BPI-0 (CTE = 12.3 × 10−6/K), PI-ref1 (CTE = 29.5 × 10−6/K), and PI-ref2 (CTE = 18.8 × 10−6/K) films. Nevertheless, the BPI films maintained good thermal stability with the 5% weight loss temperatures (T5%) higher than 590 °C, and the glass transition temperatures (Tg) higher than 340 °C. [ABSTRACT FROM AUTHOR]

Negative photosensitive polyimides (PSPIs) with the photo-patterned ability via the photocrosslinking reactions induced by the i-line (365 nm) and h-line (426 nm) emitting wavelengths in high-pressure mercury lamps have been paid increasing attention in semiconductor fabrication, optical fiber communications, and other advanced optoelectronic areas. In the current work, in view of the optical and thermo-mechanical disadvantages of the currently used negative PSPIs, such as the intrinsically photosensitive or auto-photosensitive systems derived from 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) and the ortho-alkyl- substituted aromatic diamines, a series of modified negative PSPIs with the enhanced optical transparency in the wavelength of 365~436 nm and apparently reduced coefficients of linear thermal expansion (CTE) were developed. For this purpose, a specific aromatic diamine with both of trifluoromethyl and benzanilide units in the molecular structures, 2,2'-bis(trifluoromethyl)-4,4'-bis[4-(4-amino-3-methyl)benzamide]biphenyl (MABTFMB) was copolymerized with BTDA and the standard 3,3',5,5'-tetramethyl-4,4'-diaminodiphenylmethane (TMMDA) diamine via a two-step chemical imidization procedure. As compared with the pristine PI-1 (BTDA-TMMDA) system, the new-developed fluoro-containing PSPI systems (FPI-2~FPI-7) exhibited the same-level solubility in polar aprotic solvents, including N-methyl-2-pyrrolidone (NMP) and N,N- dimethylacetamide (DMAc). The FPI films cast from the corresponding FPI solutions in NMP showed the optical transmittances of 78.3–81.3% at the wavelength of 436 nm (T436, h-line), which were much higher than that of the PI-1 (T436 = 60.9%). The FPI films showed the CTE values in the range of 40.7 × 10−6/K to 54.0 × 10−6/K in the temperature range of 50 to 250 °C, which were obviously lower than that of PI-1 (CTE = 56.5 × 10−6/K). At last, the photosensitivity of the FPI systems was maintained and the micro-pattern with the line width of 10 μm could be clearly obtained via the standard photolithography process of FPI-7 with the molar ratio of 50% for MABTFMB in the diamine moiety. [ABSTRACT FROM AUTHOR]

Enhancement of flame retardancy of a colorless and transparent semi-alicyclic polyimide (PI) film was carried out by the incorporation of phosphazene (PPZ) flame retardant (FR). For this purpose, PI-1 matrix was first synthesized from hydrogenated 3,3′,4,4′-biphenyltetracarboxylic dianhydride (HBPDA) and 4,4′-oxydianiline (ODA). The soluble PI-1 resin was dissolved in N,N-dimethylacetamide (DMAc) to afford the PI-1 solution, which was then physically blended with PPZ FR with the loading amounts in the range of 0–25 wt.%. The PPZ FR exhibited good miscibility with the PI-1 matrix when its proportion was lower than 10 wt.% in the composite films. PI-3 composite film with the PPZ loading of 10 wt.% showed an optical transmittance of 75% at the wavelength of 450 nm with a thickness of 50 μm. More importantly, PI-3 exhibited a flame retardancy class of UL 94 VTM-0 and reduced total heat release (THR), heat release rate (HRR), smoke production rate (SPR), and rate of smoke release (RSR) values during combustion compared with the original PI-1 film. In addition, PI-3 film had a limiting oxygen index (LOI) of 30.9%, which is much higher than that of PI-1 matrix (LOI: 20.1%). Finally, incorporation of PPZ FR decreased the thermal stability of the PI films. The 10% weight loss temperature (T10%) and the glass transition temperature (Tg) of the PI-3 film were 411.6 °C and 227.4 °C, respectively, which were lower than those of the PI-1 matrix (T10%: 487.3 °C; Tg: 260.6 °C) [ABSTRACT FROM AUTHOR]

Protection of polymeric materials from the atomic oxygen erosion in low-earth orbit spacecrafts has become one of the most important research topics in aerospace science. In the current research, a series of novel organic/inorganic nanocomposite films with excellent atomic oxygen (AO) resistance are prepared from the phosphorous-containing polyimide (FPI) matrix and trisilanolphenyl polyhedral oligomeric silsesquioxane (TSP–POSS) additive. The PI matrix derived from 2,2'-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) and 2,5-bis[(4-amino- phenoxy)phenyl]diphenylphosphine oxide (BADPO) itself possesses the self-healing feature in AO environment. Incorporation of TSP–POSS further enhances the AO resistance of the FPI/TSP composite films via a Si–P synergic effect. Meanwhile, the thermal stability of the pristine film is maintained. The FPI-25 composite film with a 25 wt % loading of TSP–POSS in the FPI matrix exhibits an AO erosion yield of 3.1 × 10−26 cm3/atom after an AO attack of 4.0 × 1020 atoms/cm2, which is only 5.8% and 1.0% that of pristine FPI-0 film (6FDA-BADPO) and PI-ref (PMDA-ODA) film derived from 1,2,4,5-pyromellitic anhydride (PMDA) and 4,4'-oxydianline (ODA), respectively. Inert phosphorous and silicon-containing passivation layers are observed at the surface of films during AO exposure. [ABSTRACT FROM AUTHOR]