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Nanosized titanium oxide (TiO2) material is a promising photocatalyst for the degradation of organic pollutants, whereas the difficulty of its recycling hinders its practical application. Herein, we reported the preparation of a novel titanium oxide/polysulfone (TiNPs/PSF) composite hollow microspheres by the combination of Pickering emulsification and the solvent evaporation technique and their application for the photodegradation of methyl blue (MB). P25 TiO2 nanoparticles dispersed on the surface of PSF microspheres. The porosity, density and photoactivity of the TiNPs/PSF composite microsphere are influenced by the TiO2 loading amount. The composite microsphere showed good methyl blue (MB) removal ability. Compared with TiO2 P25, and PSF, a much higher MB adsorption speed was observed for TiNPs/PSF microspheres benefited from their porous structure and the electrostatic attractions between the MB+ and the negatively charged PSF materials, and showed good degradation efficiency. For TiNPs/PSF composite microsphere with density close to 1, a 100% MB removal (10 mg L−1) within 120 min at a catalyst loading of 2.5 g L−1 can be obtained under both stirring and static condition, due to well dispersing of TiO2 particles on the microsphere surface and its stable suspending in water. For the non-suspended TiNPs/PSF composite microsphere with density bigger than 1, the 100% MB removal can be only obtained under stirring condition. The removal efficiency of MB for the composite microspheres retained 96.5%, even after 20 cycles. Moreover, this composite microsphere also showed high MB removal ability at acidic condition. The high catalysis efficiency, excellent reusability and good stability make this kind of TiNPs/PSF composite microsphere a promising photocatalyst for the water organic pollution treatment. [ABSTRACT FROM AUTHOR]

To achieve polyimide-metal complexes with enhanced properties, 5-amine-2-(5-aminopyridin-2-yl)-1-methyl-benzimidazole (PyMePABZ) that contains stiff 2-(2′-pyridyl)benzimidazole (PyBI) was synthesized and exploited to construct the Cu(ΙΙ)-crosslinked polyimides (Cu-PIs). These Cu-PIs exhibited higher dielectric, thermal, and mechanical properties with an increase in Cu2+ content. Among them, their dielectric constants (εrS) were up to 43% superior to that of the neat PI, glass transition temperatures (Tgs) were all over 400 °C, and 5% weight loss temperature (T5%) maintained beyond 500 °C. These data indicate that the metal coordination crosslinking provided a useful guide to develop high performance PIs which possess potential application as useful high temperature capacitors. [ABSTRACT FROM AUTHOR]