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15 results on '"Jalar, Azman"'

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1. Flux Modification for Wettability and Reliability Improvement in Solder Joints

2. The Effect of Isothermal Ageing Treatment on Different PCB Surface Finishes: Simulation and Experimental

3. Solder Paste’s Rheology Data for Stencil Printing Numerical Investigations

4. Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders

5. The Effect of Laser Soldering onto Intermetallic Compound Formation, Growth

6. Reliability Analysis on the Flexible Printed Circuit Board After Reflow Soldering

7. Tin Whiskers Growth in Electronic Assemblies

8. Advancement of Printed Circuit Board (PCB) Surface Finishes in Controlling the Intermetallic Compound (IMC) Growth in Solder Joints

9. Development of Geopolymer Ceramic-Reinforced Solder

10. Significance of Intermetallic Compound (IMC) Layer to the Reliability of a Solder Joint, Methods of IMC Layer Thickness Measurements

11. Molecular Dynamic of the Nanoparticle Reinforcement in the Pb-Free Solder During Reflow Soldering Process

12. Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder

13. Properties of Sn0.7Cu Solder Alloys Bearing Fe and Bi

14. Advanced Assembly of Miniaturized Surface Mount Technology Components Using Nano-reinforced Solder Paste

15. Recent Progress in Transient Liquid Phase (TLP) Solder for Next Generation Power Electronics

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