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Your search keyword '"van Grunsven, E."' showing total 1 results
Start Over Author "van Grunsven, E." Publication Year Range Last 50 years Journal solid state technology
1 results on '"van Grunsven, E."'

1. System-in-package integration of passives using: 3D through-silicon vias

Author

Roozeboom, F., Dekkers, W., Lamy, Y., Klootwijk, J.H., van Grunsven, E., and Kim, H.-D.

Subjects
Electroplating -- Usage -- Evaluation, Radio transmitters -- Evaluation -- Usage, Silicon -- Usage -- Evaluation, Integrators -- Usage -- Methods, Semiconductor doping -- Methods -- Usage, Etching -- Usage -- Methods
Abstract

EXECUTIVE OVERVIEW Future generations of cellular RF transceivers require higher degrees of integration, preferably using the third dimension. System-in-Package (SiP) applications have been shown for integrated 3D 'trench' capacitors in […]

Published
2008

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